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PDF BU2525DF Data sheet ( Hoja de datos )

Número de pieza BU2525DF
Descripción Silicon Diffused Power Transistor
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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Philips Semiconductors
Silicon Diffused Power Transistor
Product specification
BU2525DF
GENERAL DESCRIPTION
New generation, high-voltage, high-speed switching npn transistor with integrated damper diode in a plastic
full-pack envelope intended for use in horizontal deflection circuits of large screen colour television receivers up to
32 kHz.
QUICK REFERENCE DATA
SYMBOL
VCESM
VCEO
IC
ICM
Ptot
VCEsat
ICsat
ts
PARAMETER
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
Collector saturation current
Storage time
CONDITIONS
VBE = 0 V
Ths 25 ˚C
IC = 8.0 A; IB = 1.6 A
ICsat = 8.0 A; IB(end) = 1.1 A
TYP.
-
-
-
-
-
-
8.0
3.0
MAX.
1500
800
12
30
45
5.0
-
4.0
UNIT
V
V
A
A
W
V
A
µs
PINNING - SOT199
PIN DESCRIPTION
1 base
2 collector
3 emitter
case isolated
PIN CONFIGURATION
case
1 23
SYMBOL
c
b
Rbe
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
VCESM
VCEO
IC
ICM
IB
IBM
-IB(AV)
-IBM
Ptot
Tstg
Tj
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Base current (DC)
Base current peak value
Reverse base current
Reverse base current peak value 1
Total power dissipation
Storage temperature
Junction temperature
VBE = 0 V
average over any 20 ms period
Ths 25 ˚C
THERMAL RESISTANCES
SYMBOL
Rth j-hs
Rth j-hs
Rth j-a
PARAMETER
Junction to heatsink
Junction to heatsink
Junction to ambient
CONDITIONS
without heatsink compound
with heatsink compound
in free air
MIN.
-
-
-
-
-
-
-
-
-
-65
-
MAX.
1500
800
12
30
8
12
200
9
45
150
150
UNIT
V
V
A
A
A
A
mA
A
W
˚C
˚C
TYP.
-
-
35
MAX.
3.7
2.8
-
UNIT
K/W
K/W
K/W
1 Turn-off current.
September 1997
1
Rev 1.200

1 page




BU2525DF pdf
Philips Semiconductors
Silicon Diffused Power Transistor
Product specification
BU2525DF
Zth / (K/W)
10
BU2525AF
1 0.5
0.2
0.1
0.05
0.1
0.02
0.01
PD tp
D = tp
T
D=0
0.001
1E-06
1E-04
1E-02
t/s
Tt
1E+00
Fig.13. Transient thermal impedance.
Zth j-hs = f(t); parameter D = tp/T
IC / A
100
ICM
ICDC
10
= 0.01
Ptot
1
BU2525AF
tp =
40 us
100 us
1 ms
0.1
10 ms
DC
0.01
1 10 100 1000 VCE / V
Fig.14. Forward bias safe operating area. Ths = 25 ˚C
ICDC & ICM = f(VCE); ICM single pulse; parameter tp
Second-breakdown limits independant of temperature.
Mounted with heatsink compound.
September 1997
5
Rev 1.200

5 Page










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