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BUF04GS PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 BUF04GS
기능 Closed-Loop High Speed Buffer
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BUF04GS 데이터시트, 핀배열, 회로
a
FEATURES
Bandwidth – 110 MHz
Slew Rate – 3000 V/s
Low Offset Voltage – <1 mV
Very Low Noise – < 4 nV/Hz
Low Supply Current – 8.5 mA Mux
Wide Supply Range – ؎5 V to ؎15 V
Drives Capacitive Loads
Pin Compatible with BUF03
APPLICATIONS
Instrumentation Buffer
RF Buffer
Line Driver
High Speed Current Source
Op Amp Output Current Booster
High Performance Audio
High Speed AD/DA
Closed-Loop
High Speed Buffer
BUF04*
FUNCTIONAL BLOCK DIAGRAMS
8-Lead Narrow-Body SO
(S Suffix)
Plastic DIP
8-Lead and Cerdip
(P, Z Suffix)
1
BUF04
NULL 1
NC 2
IN 3
V– 4
BUF04
Top View
8 NULL
7 V+
6 OUT
5 NC
NC = NO CONNECT
GENERAL DESCRIPTION
The BUF04 is a wideband, closed-loop buffer that combines
state of the art dynamic performance with excellent dc
performance. This combination enables designers to maximize
system performance without any speed versus dc accuracy
compromises.
Built on a high speed Complementary Bipolar (CB) process for
better power performance ratio, the BUF04 consumes less than
8.5 mA operating from ±5 V or ±15 V supplies. With a 2000 V/µs
min slew rate, and 100 MHz gain bandwidth product, the
BUF04 is ideally suited for use in high speed applications where
low power dissipation is critical.
Full ± 10 V output swing over the extended temperature range
along with outstanding ac performance and high loop gain
accuracy makes the device useful in high speed data acquisition
systems.
High slew rate and very low noise and THD, coupled with wide
input and output dynamic range, make the BUF04 an excellent
choice for video and high performance audio circuits.
The BUF04’s inherent ability to drive capacitive loads over a
wide voltage and temperature range makes it extremely useful
for a wide variety of applications in military, industrial, and
commercial equipment.
The BUF04 is specified over the extended industrial (–40°C to
+85°C) and military (–55°C to +125°C) temperature range.
BUF04s are available in plastic and ceramic DIP plus SO-8
surface mount packages.
Contact your local sales office for MIL-STD-883 data sheet and
availability.
*Patent pending.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700
Fax: 617/326-8703




BUF04GS pdf, 반도체, 판매, 대치품
BUF04
WAFER TEST LIMITS (@ VS = ؎15.0 V, TA = +25؇C unless otherwise noted)
Parameter
Symbol
Conditions
Limit
Units
Offset Voltage
Input Bias Current
Power Supply Rejection Ratio
Output Voltage Range
Supply Current
Gain
VOS
VOS
IB
PSRR
VO
ISY
AVCL
VS = ± 15 V
VS = ± 5 V
VCM = 0 V
V = ± 4.5 V to ± 18 V
RL = 150
VO = 0 V, RL = 2 k
VO = ± 10 V, RL = 2 k
1
2
5
76
± 10.5
8.5
1 ± 0.005
mV max
mV max
µA max
dB
V min
mA max
V/V
NOTE
Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard
product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Maximum Power Dissipation . . . . . . . . . . . . . . . See Figure 16
Storage Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +175°C
P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
BUF04Z . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
BUF04S, P . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300°C
DICE CHARACTERISTICS
Package Type
8-Pin Cerdip (Z)
8-Pin Plastic DIP (P)
8-Pin SOIC (S)
θJA2
148
103
158
θJC Units
16 °C/W
43 °C/W
43 °C/W
NOTES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2θJA is specified for the worst case conditions, i.e., θJA is specified for device in socket
for cerdip, P-DIP, and LCC packages; θJA is specified for device soldered in circuit
board for SOIC package.
BUF04 Die Size 0.075 x 0.064 inch, 5,280 Sq. Mils
Substrate (Die Backside) Is Connected to V+
Transistor Count 45.
ORDERING GUIDE
Model
BUF04AZ/883
BUF04GP
BUF04GS
BUF04GBC
Temperature
Range
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
+25°C
Package
Description
Cerdip
Plastic DIP
SO
DICE
Package
Option
Q-8
N-8
SO-8
DICE
–4– REV. 0

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BUF04GS 전자부품, 판매, 대치품
0.5
0
–0.5
–1.0
–1.5
TA = +25°C
–2.0
–10 –8 –6 –4 –2 0 2 4 6 8
COMMON MODE VOLTAGE – Volts
Figure 13. Bias Current vs. Input Voltage
10
100
90 TA = +25°C
VS = ±5, ±15V
80
70 – PSRR
60
50
40
30 +PSRR
20
10
0
1k
10k 100k 1M
10M
100M
FREQUENCY – Hz
Figure 14. Power Supply Rejection vs. Frequency
6000
5000
4000
+EDGE
VS = ±15V
3000
2000
–EDGE
1000
0
–75 –50 –25
0
25 50 75 100
TEMPERATURE – °C
Figure 15. Slew Rate vs. Temperature
125
1.5
P DIP
ΘJA = 103°C/W
1.0 CERDIP
ΘJA = 148°C/W
SOIC
ΘJA = 158°C/W
0.5
BUF04
TJ MAX = 150°C
FREE AIR
NO HEAT SINK
0
0
25
50
75 85 100
125
TEMPERATURE – °C
Figure 16. Maximum Power Dissipation vs.
Ambient Temperature
100
10
0
1 10 100 1k 10k 100k 1M
FREQUENCY – Hz
Figure 17. Input Noise Voltage vs. Frequency
6000
5000
4000
POSITIVE
SLEW RATE
VS = ±15V
SWING = ±10V
TA = +25°C
3000
2000
NEGATIVE
SLEW RATE
1000
0
0 50 100 150 200 250
CAPACITIVE LOAD – pF
Figure 18. Slew Rate vs. Capacitive Loads
REV. 0
–7–

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