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PDF ULN2075B Data sheet ( Hoja de datos )
| Número de pieza | ULN2075B | |
| Descripción | 80 V - 1.5 A QUAD DARLINGTON SWITCHES | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de ULN2075B (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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ULN2065B - ULN2067B
ULN2069B - ULN2071B
ULN2075B - ULN2077B
80 V - 1.5 A QUAD DARLINGTON SWITCHES
. OUTPUT CURRENT TO 1.5 A EACH DAR-
LINGTON
. MINIMUM BREAKDOWN 80 V
. SUSTAINING VOLTAGE AT LEAST 50 V
. INTEGRAL SUPPRESSION DIODES
(ULN2065B, ULN2067B, ULN2069B and
ULN2071B)
. ISOLATEDDARLINGTON PINOUT (ULN2075B
and ULN2077B)
. VERSIONS COMPATIBLE WITH ALL POPU-
LAR LOGIC FAMILIES
DES CRI P TI O N
Designed to interface logic to a wide variety of high
current, high voltageloads, these devices each con-
tain four NPN darlington switches delivering up to
1.5 A with a specified minimum breakdown of 80 V
and a sustaining voltage of 50 V. The ULN2065B,
ULN2067B, ULN2069B and ULN2071B contain in-
tegral suppression diodes for inductive loads and
have common emitters ; the ULN2075B and
ULN2077B feature isolated darlington pinouts and
are intended for applications such as emitter fol-
lower configurations. Inputs of the ULN2065B,
ULN2069B and ULN2075B are compatible with
popular 5 V logic families and the ULN2067B,
ULN2071B and ULN2077B are compatible with 6-
15 VCMOS and PMOS. The ULN2069B and
ULN2071B include a predriver stage to provide ex-
tragain, reducing the load on control logic.
PO WERDIP
12 + 2 + 2
PIN CONNECTIONS AND ORDER CODES
April 1993
ULN2065B
ULN2067B
ULN2069B
ULN2071B
ULN2075B
ULN2077B
1/7
1 page  
ULN2065B-ULN2067B-ULN2069B-ULN2071B-ULN2075B-ULN2077B
MOUNTING INSTRUCTIONS
The Rth j-amb can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Fig. 12) or to an external heatsink (Fig. 13).
The diagram of figure 14 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
the side ”∝” of two equal square copper areas hav-
ing a thickness of 35 µ (1.4 mils).
Figure 12 : Example of P.C. Board Area which is
Used as Heatsink.
During soldering the pins temperature must not ex-
ceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 13 : External Heatsink Mounting Example.
Figure 14 : Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
vs. Side ”I”.
Figure 15 : Maximum Allowable Power Dissipa-
tion vs. Ambient Temperature.
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet ULN2075B.PDF ] | |
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