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PDF UMC5 Data sheet ( Hoja de datos )
| Número de pieza | UMC5 | |
| Descripción | Dual Common Base-Collector Bias Resistor Transistors | |
| Fabricantes | ON Semiconductor | |
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UMC2NT1, UMC3NT1,
UMC5NT1
Preferred Devices
Dual Common
Base-Collector Bias
Resistor Transistors
NPN and PNP Silicon Surface Mount
Transistors with Monolithic Bias
Resistor Network
The BRT (Bias Resistor Transistor) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a base–emitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the UMC2NT1 series, two
complementary BRT devices are housed in the SOT–353 package
which is ideal for low power surface mount applications where board
space is at a premium.
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7 inch/3000 Unit Tape and Reel.
MAXIMUM RATINGS (TA = 25°C unless otherwise noted, common for Q1
and Q2, – minus sign for Q1 (PNP) omitted)
Rating
Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
THERMAL CHARACTERISTICS
VCBO
VCEO
IC
50 Vdc
50 Vdc
100 mAdc
Thermal Resistance – Junction-to-Ambient
(surface mounted)
RθJA
833 °C/W
Operating and Storage Temperature
Range
TJ, Tstg
–65 to
+150
°C
Total Package Dissipation
@ TA = 25°C (Note 1.)
PD
DEVICE MARKING AND RESISTOR VALUES
*150
mW
Transistor 1 – PNP Transistor 2 – NPN
Device
Marking
R1 (K)
R2 (K)
R1 (K)
R2 (K)
UMC2NT1
U2
22 22 22 22
UMC3NT1
U3
10 10 10 10
UMC5NT1
U5
4.7 10
47
47
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
http://onsemi.com
32
R1 R2
1
Q1
4
R2
R1
Q2
5
SC–88A/SOT–323
CASE 419A
STYLE 6
MARKING
DIAGRAM
54
Ux
1 23
Ux = Device Marking
x = 2, 3 or 5
ORDERING INFORMATION
Device
Package
Shipping
UMC2NT1
SOT–323 3000/Tape & Reel
UMC3NT1
SOT–323 3000/Tape & Reel
UMC5NT1
SOT–323 3000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2001
April, 2001 – Rev. 1
1
Publication Order Number:
UMC2NT1/D
1 page  
UMC2NT1, UMC3NT1, UMC5NT1
TYPICAL ELECTRICAL CHARACTERISTICS — UMC2NT1 NPN TRANSISTOR
1
IC/IB = 10
0.1
0.01
TAĂ=Ă-25°C
25°C
75°C
1000
100
VCE = 10 V
TAĂ=Ă75°C
25°C
-25°C
0.001
0
20 40
IC, COLLECTOR CURRENT (mA)
Figure 7. VCE(sat) versus IC
10
50 1
10
IC, COLLECTOR CURRENT (mA)
Figure 8. DC Current Gain
100
4 100 25°C
f = 1 MHz
75°C
3
IE = 0 mA
TA = 25°C
10
TAĂ=Ă-25°C
1
2
0.1
1
0.01
VO = 5 V
0 0 10 20 30 40 50 0.001 0 1 2 3 4 5 6 7 8 9 10
VR, REVERSE BIAS VOLTAGE (VOLTS)
Vin, INPUT VOLTAGE (VOLTS)
Figure 9. Output Capacitance
Figure 10. Output Current versus Input Voltage
10
VO = 0.2 V
1
TAĂ=Ă-25°C
75°C
25°C
0.1
0 10 20 30 40
IC, COLLECTOR CURRENT (mA)
Figure 11. Input Voltage versus Output
Current
50
http://onsemi.com
5
5 Page 
UMC2NT1, UMC3NT1, UMC5NT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 31 shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
SOAK"
SPIKE"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 31. Typical Solder Heating Profile
http://onsemi.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet UMC5.PDF ] | |
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