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부품번호 | UPC8178TB 기능 |
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기능 | SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS | ||
제조업체 | NEC | ||
로고 | |||
전체 28 페이지수
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8179TB
SILICON MMIC LOW CURRENT AMPLIFIER
FOR MOBILE COMMUNICATIONS
DESCRIPTION
The µPC8179TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This
IC can realize low current consumption with external chip inductor which can not be realized on internal 50 Ω
wideband matched IC. This low current amplifier operates on 3.0 V.
This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This
process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface
from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Low current consumption
: ICC = 4.0 mA TYP. @ VCC = 3.0 V
• Supply voltage
: VCC = 2.4 to 3.3 V
• High efficiency
: PO (1 dB) = +3.0 dBm TYP. @ f = 1.0 GHz
PO (1 dB) = +1.5 dBm TYP. @ f = 1.9 GHz
PO (1 dB) = +1.0 dBm TYP. @ f = 2.4 GHz
• Power gain
: GP = 13.5 dB TYP. @ f = 1.0 GHz
GP = 15.5 dB TYP. @ f = 1.9 GHz
GP = 15.5 dB TYP. @ f = 2.4 GHz
• Excellent isolation
: ISL = 44 dB TYP. @ f = 1.0 GHz
ISL = 42 dB TYP. @ f = 1.9 GHz
ISL = 41 dB TYP. @ f = 2.4 GHz
• Operating frequency
: 0.1 to 2.4 GHz (Output port LC matching)
• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
• Light weight
: 7 mg (Standard value)
APPLICATION
• Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P14730EJ2V0DS00 (2nd edition)
Date Published August 2000 N CP(K)
Printed in Japan
©
2000
µPC8179TB
PIN EXPLANATION
Pin Pin
Applied
No. Name Voltage
(V)
1 INPUT
−
Pin
Voltage
(V)Note
1.09
Function and Applications
Signal input pin. A internal
matching circuit, configured with
resisters, enables 50 Ω connec-
tion over a wide band. This pin
must be coupled to signal source
with capacitor for DC cut.
Internal Equivalent Circuit
2 GND
3
5
0
− Ground pin. This pin should be
connected to system ground with
minimum inductance. Ground
pattern on the board should be
formed as wide as possible.
All the ground pins must be con-
nected together with wide ground
pattern to decrease impedance
↓
defference.
6
4
4 OUTPUT voltage
as same
as VCC
through
external
inductor
− Signal output pin. This pin is de-
signed as collector output. Due
to the high impedance output,
this pin should be externally
equipped with LC matching
circuit to next stage. For L, a
size 1005 chip inductor can be
chosen.
31
2
5
6 VCC 2.4 to 3.3 − Power supply pin. This pin
should be externally equipped
with bypass capacitor to
minimize its impedance.
Note Pin voltage is measured at VCC = 3.0 V.
4 Data Sheet P14730EJ2V0DS00
4페이지 µPC8179TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
<1> f = 1.0 GHz
Top View
Connector
Mounting direction
IN
C1
OUT
C2 Connector
C3
COMPONENT LIST
1.0 GHz Output Port Matching
C1 1 000 pF
C2 0.75 pF
C3 10 pF
L1 12 nH
Data Sheet P14730EJ2V0DS00
7
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부품번호 | 상세설명 및 기능 | 제조사 |
UPC8178TB | SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS | NEC |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |