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74LS367 데이터시트 PDF




Motorola Semiconductors에서 제조한 전자 부품 74LS367은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 74LS367 자료 제공

부품번호 74LS367 기능
기능 3-STATE HEX BUFFERS
제조업체 Motorola Semiconductors
로고 Motorola Semiconductors 로고


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74LS367 데이터시트, 핀배열, 회로
3-STATE HEX BUFFERS
These devices are high speed hex buffers with 3-state outputs. They are
organized as single 6-bit or 2-bit / 4-bit, with inverting or non-inverting data (D)
paths. The outputs are designed to drive 15 TTL Unit Loads or 60 Low Power
Schottky loads when the Enable (E) is LOW.
When the Output Enable (E) is HIGH, the outputs are forced to a high
impedance “off” state. If the outputs of the 3-state devices are tied together,
all but one device must be in the high impedance state to avoid high currents
that would exceed the maximum ratings. Designers should ensure that Output
Enable signals to 3-state devices whose outputs are tied together are
designed so there is no overlap.
SN54/74LS365A
SN54/74LS366A
SN54/74LS367A
SN54/74LS368A
3-STATE HEX BUFFERS
LOW POWER SCHOTTKY
16
1
16
1
16
1
J SUFFIX
CERAMIC
CASE 620-09
N SUFFIX
PLASTIC
CASE 648-08
D SUFFIX
SOIC
CASE 751B-03
GUARANTEED OPERATING RANGES
Symbol
Parameter
VCC
Supply Voltage
TA Operating Ambient Temperature Range
IOH Output Current — High
IOL Output Current — Low
ORDERING INFORMATION
SN54LSXXXJ
SN74LSXXXN
SN74LSXXXD
Ceramic
Plastic
SOIC
Min Typ Max Unit
54 4.5 5.0 5.5
74 4.75 5.0 5.25
V
54 – 55 25 125 °C
74 0 25 70
54
– 1.0
mA
74 – 2.6
54 12 mA
74 24
FAST AND LS TTL DATA
5-516




74LS367 pdf, 반도체, 판매, 대치품
Case 751B-03 D Suffix
16-Pin Plastic
SO-16
-A-
16 9
-B-
P 0.25 (0.010) M
BM
1
8 PL
8
G
-T-
D16 PL
0.25 (0.010) M T B S
AS
C
SEATING
PLANE
K
R X 45°
MF
J
Case 648-08 N Suffix
16-Pin Plastic
-A-
16 9
B
18
F
C
S
-T-
SEATING
PLANE
L
H
G
D 16 PL
K
0.25 (0.010) M T A M
J
M
Case 620-09 J Suffix
-A- 16-Pin Ceramic Dual In-Line
16 9
-B-
18
CL
-T-
SEATING
PLANE
F
E
G
D 16 PL
N
0.25 (0.010) M T A S
K
M
J 16 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. 751BĆ01 IS OBSOLETE, NEW STANDARD
751BĆ03.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0°Ă
0.25
7°Ă
5.80
6.20
0.25
0.50
INCHES
MIN MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0°Ă
0.009
7°Ă
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L" TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B" DOES NOT INCLUDE MOLD
FLASH.
5. ROUNDED CORNERS OPTIONAL.
6. 648Ć01 THRU Ć07 OBSOLETE, NEW STANDARD
648Ć08.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MILLIMETERS
MIN MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
0°
7.74
10°
0.51
1.01
INCHES
MIN MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.070
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0°
0.305
10°
0.020
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
5. 620Ć01 THRU Ć08 OBSOLETE, NEW STANDARD
620Ć09.
DIM
A
B
C
D
E
F
G
J
K
L
M
N
MILLIMETERS
MIN MAX
19.05 19.55
6.10
7.36
Ċ 4.19
0.39
0.53
1.27 BSC
1.40
1.77
2.54 BSC
0.23
0.27
Ċ 5.08
7.62 BSC
0° 15°
0.39
0.88
INCHES
MIN MAX
0.750
0.770
0.240
0.290
Ċ 0.165
0.015
0.021
0.050 BSC
0.055
0.070
0.100 BSC
0.009
0.011
Ċ 0.200
0.300 BSC
0° 15°
0.015
0.035
FAST AND LS TTL DATA
5-519

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