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부품번호 | TDA1175P 기능 |
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기능 | LOW-NOISE VERTICAL DEFLECTION SYSTEM | ||
제조업체 | ST Microelectronics | ||
로고 | |||
전체 8 페이지수
TDA1175P
LOW-NOISE VERTICAL DEFLECTION SYSTEM
. COMPLETE VERTICAL DEFLECTION
SYSTEM
. LOW NOISE
. SUITABLE FOR HIGH DEFINITION
MONITORS
. ESD PROTECTED
DESCRIPTION
The TDA1175P is a monolithic integrated circuit in
POWERDIP16 plastic package. It is intended for
use in black and white and colour TV receivers.
Low-noise makes this device particularly suitable
for use in monitors.
The functions incorporated are : synchronization
circuit, oscillator and ramp generator, high power
gain amplifier, flyback generator, voltage regulator.
PIN CONNECTIONS
POWERDIP16
(Plastic Package)
ORDER CODE : TDA1175P
RAMP OUTPUT
SUPPLY VOLTAGE
FLYBACK
GROUND
GROUND
POWER AMPLIFIER OUTPUT
POWER AMPLIFIER
SUPPLY VOLTAGE
REGULATED VOLTAGE
1
2
3
4
5
6
7
8
16 RAMP GENERATOR
15 COMPENSATION
14 AMP. INPUT
13 GROUND
12 GROUND
11 OSCILLATOR
10 SYNC. INPUT
9 HEIGHT ADJUSTMENT
August 1995
1/8
TDA1175P
Figure 1 : DC Test Circuits
Figure 1a
V3 I 3 +VS
3 27
10
TDA1175P
11
6
I8
9 16
14
TABS
1kΩ - I 9
- I 12
1V 1V 8V
R2
R1
V4
Figure 1b
I 2 +VS
I5
27
11 TDA1175P 14
8 16
V6 - I 12
9
TABS
- I 10
V7
1V
Figure 1c
+VS
27
11 TDA1175P 6
14
TABS
4V
I4
V4L
Figure 1d
+VS
27
11 TDA1175P 6
14
TABS
1V
V 4H
I4
4/8
4페이지 TDA1175P
MOUNTING INSTRUCTION
The Rth (j-a) can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Figure 5) or to an external heatsink (Fig-
ure 6).
The diagram of Figure 7 shows the maximum
dissipable power Ptot and the Rth (j-a) as a function
of the side ”I” of two equal square copper areas
Figure 5 : Example of P.C. Board Copper Area
having a thicknessof 35µ (1.4 mils).
During soldering the pins temperature must not
exceed 260°C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 6 : External Heatsink Mounting Example
Figure 7 : Maximum Power Dissipation and
Junction-ambient Thermal
Resistance versus ”I”
Figure 8 : Maximum Allowable Power Dissipation
versus Ambient Temperature
7/8
7페이지 | |||
구 성 | 총 8 페이지수 | ||
다운로드 | [ TDA1175P.PDF 데이터시트 ] |
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구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
TDA1175 | LOW-NOISE VERTICAL DEFLECTION SYSTEM | ST Microelectronics |
TDA1175P | LOW-NOISE VERTICAL DEFLECTION SYSTEM | ST Microelectronics |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |