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PDF TDA1308 Data sheet ( Hoja de datos )
| Número de pieza | TDA1308 | |
| Descripción | Class AB stereo headphone driver | |
| Fabricantes | NXP Semiconductors | |
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TDA1308
Class-AB stereo headphone driver
Rev. 5 — 14 March 2011
Product data sheet
1. General description
The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or
a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal
Oxide Semiconductor (CMOS) process and has been primarily developed for portable
digital audio applications.
2. Features and benefits
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
High signal-to-noise ratio
High slew rate
Low distortion
Large output voltage swing
3. Quick reference data
Table 1. Quick reference data
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max
VDD supply voltage single supply
dual supply
3.0 5.0 7.0
1.5 2.5 3.5
VSS
negative supply
dual supply
voltage
−1.5 −2.5 −3.5
IDD supply current no load
Ptot total power
dissipation
no load
- 35
- 15 25
Po
THD+N
output power
total harmonic
distortion-plus-noise
maximum; THD+N < 0.1 %
[1] -
[1] -
[1] -
40 80
0.03 0.06
−70 −65
RL = 5 kΩ
S/N signal-to-noise ratio
- −101 -
100 110 -
Unit
V
V
V
mA
mW
mW
%
dB
dB
dB
1 page  
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
10. Characteristics
Table 6. Characteristics
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Supplies
VDD supply voltage
single supply
dual supply
3.0
1.5
VSS negative supply voltage
IDD supply current
Ptot total power dissipation
Static characteristics
dual supply
no load
no load
−1.5
-
-
|VI(offset)|
input offset voltage
IIB input bias current
Vcm common-mode voltage
Gv(ol)
open-loop voltage gain
RL = 5 kΩ
IO output current
maximum
Ro output resistance
THD+N < 0.1 %
ΔVO output voltage variation
RL = 16 Ω
RL = 5 kΩ
αcs channel separation
RL = 5 kΩ
PSRR
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV
CL load capacitance
Dynamic characteristics
-
-
0
-
-
-
[1] 0.75
[1] 1.5
[1] 0.1
-
[1] -
-
-
THD+N
total harmonic
distortion-plus-noise
[2] -
[2] -
RL = 5 kΩ
RL = 5 kΩ
S/N signal-to-noise ratio
[2] -
[2] -
100
f1
unity gain frequency
open-loop; RL = 5 kΩ
Po output power
maximum; THD+N < 0.1 %
Ci input capacitance
SR slew rate
unity gain inverting
-
-
-
-
B bandwidth
unity gain inverting
-
[1] Values are proportional to VDD; THD+N < 0.1 %.
[2] VDD = 5 V; Vo(p-p) = 3.5 V (at 0 dB).
Typ Max
5.0 7.0
2.5 3.5
−2.5 −3.5
35
15 25
10 -
10 -
- 3.5
70 -
60 -
0.25 -
- 4.25
- 3.5
- 4.9
70 -
105 -
90 -
- 200
0.03
−70
−101
0.0009
110
5.5
40
3
5
20
0.06
−65
-
-
-
-
80
-
-
-
Unit
V
V
V
mA
mW
mV
pA
pA
dB
mA
Ω
V
V
V
dB
dB
dB
pF
%
dB
dB
%
dB
MHz
mW
pF
V/μs
kHz
TDA1308
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 14 March 2011
© NXP B.V. 2011. All rights reserved.
5 of 17
5 Page 
NXP Semiconductors
TDA1308
Class-AB stereo headphone driver
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TDA1308
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 14 March 2011
© NXP B.V. 2011. All rights reserved.
11 of 17
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| PDF Descargar | [ Datasheet TDA1308.PDF ] | |
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