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PDF HYS72V2100GCU-10 Data sheet ( Hoja de datos )
| Número de pieza | HYS72V2100GCU-10 | |
| Descripción | 3.3V 2M x 64-Bit SDRAM Module 3.3V 2M x 72-Bit SDRAM Module | |
| Fabricantes | Siemens | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HYS72V2100GCU-10 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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3.3V 2M x 64-Bit SDRAM Module
3.3V 2M x 72-Bit SDRAM Module
168 pin unbuffered DIMM Modules
HYS64V2100G(C)U-10
HYS72V2100G(C)U-10
• 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual-In-Line SDRAM Module
for PC main memory applications
• 1 bank 2M x 64, 2M x 72 organisation
• Optimized for byte-write non-parity or ECC applications
• Fully PC66 layout compatible
• JEDEC standard Synchronous DRAMs (SDRAM)
• Performance:
fCK Max. Clock frequency
tAC Max. access time from clock
-10
66 MHz @ CL=2
100 MHz @ CL=3
9 ns @ CL=2
8 ns @ CL=3
• Single +3.3V(± 0.3V ) power supply
• Programmable CAS Latency, Burst Length and Wrap Sequence
(Sequential & Interleave)
• Auto Refresh (CBR) and Self Refresh
• Decoupling capacitors mounted on substrate
• All inputs, outputs are LVTTL compatible
• Serial Presence Detect with E2PROM
• Utilizes eight / nine 2M x 8 SDRAMs in TSOPII-44 packages
• 4096 refresh cycles every 64 ms
• Gold contact pad
• Card Size: 133,35mm x 29,21mm x 3,00mm for HYS64/72V2100GU
• HYS64/72V2100GCU in chip-on-board technique
• Card Size : 133,35mm x 25,40mm x 3,00mm for HYS64/72V2100GCU
•
Semiconductor Group
1
12.97
1 page  
HYS64(72)V2100G(C)U-10
2M x 64/72 SDRAM-Module
DC Characteristics
TA = 0 to 70 °C; VSS = 0 V; V VDD, DDQ = 3.3 V ± 0.3 V
Parameter
Input high voltage
Input low voltage
Output high voltage (IOUT = – 2.0 mA)
Output low voltage (IOUT = 2.0 mA)
Input leakage current, any input
(0 V < VIN < 3.6 V, all other inputs = 0 V)
Output leakage current
(DQ is disabled, 0 V < VOUT < VCC)
Symbol
VIH
VIL
VOH
VOL
II(L)
IO(L)
Limit Values
min.
max.
2.0 Vcc+0.3
– 0.5
0.8
2.4 –
– 0.4
– 40 40
Unit
V
V
V
V
µA
– 40
40 µA
Capacitance
TA = 0 to 70 °C; VDD = 3.3 V ± 0.3 V, f = 1 MHz
Parameter
Symbol
Input capacitance (A0 to A10, BS, RAS, CAS, WE)
Input capacitance ( CS0 - CS3)
Input capacitance (CLK0 - CLK3)
Input capacitance (DQMB0 - DQMB7)
Input / Output capacitance (DQ0-DQ63,CB0-CB7)
Input Capacitance (SCL,SA0-2)
Input/Output Capacitance
CI1
CI2
CI3
CI4
CIO
Csc
Csd
Limit Values
min.
(x64)
max.
(x72)
45 55
20 25
22 38
13 13
12 12
88
10 10
Unit
pF
pF
pF
pF
pF
pF
pF
Semiconductor Group
5
5 Page 
HYS64(72)V2100G(C)U-10
2M x 64/72 SDRAM-Module
SPD-Table (contd’ )
Byte#
Description
28 Minimum Row Active to Row Active delay
tRRD
29 Minimum RAS to CAS delay tRCD
30 Minimum RAS pulse width tRAS
31 Module Bank Density (per bank)
32-61 Superset information (may be used in
future)
62 SPD Revision
63 Checksum for bytes 0 - 62
64- Manufacturess’ information (optional)
127 (FFh if not used)
128+ Unused storage locations
SPD Entry Value
Hex
20 ns
x64 x72
14 14
30 ns
45 ns
16 MByte
1E 1E
2D 2D
04 04
FF FF
Revision 1
01 01
F3 05
FF FF
FF FF
L-DIM-168-27
SDRAM DIMM Module package
133,35
127,35
3,0
1 10 11
42,18
66,68
A
85 94 95
40 41
B
124 125
AC
84
168
6,35
2,0
Detail A
6,35
2,0
Detail B
1,27 1,0 +- 0.5
Detail C
0,2 +- 0,15
DM168-27.WMF(EWK)
Semiconductor Group
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet HYS72V2100GCU-10.PDF ] | |
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