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IAM-91563 데이터시트 PDF




Agilent(Hewlett-Packard)에서 제조한 전자 부품 IAM-91563은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 IAM-91563 기능
기능 0.8-6 GHz 3V Downconverter
제조업체 Agilent(Hewlett-Packard)
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IAM-91563 데이터시트, 핀배열, 회로
www.DataSheet4U.com
0.8 – 6 GHz 3 V Downconverter
Technical Data
IAM-91563
Features
• +0 dBm Input IP3 at 1.9 GHz
• Single +3V Supply
• 8.5 dB SSB Noise Figure at
1.9 GHz
• 9.0 dB Conversion Gain at
1.9 GHz
• Ultra-miniature Package
Applications
• Downconverter for PCS,
PHS, ISM, WLL, and other
Wireless Applications
Surface Mount Package
SOT-363 (SC-70)
Pin Connections and
Package Marking
LO 1
GND 2
6 IF and Vd
5 GND
RF 3
4 SOURCE
BYPASS
Simplified Schematic
LO
1
RF
3
Note:
1. Package marking provides orienta-
tion and identification.
IF and Vd
6
SOURCE
BYPASS
4
GROUND
2, 5
7-135
Description
Hewlett-Packard’s IAM-91563 is an
economical 3V GaAs MMIC mixer
used for frequency down-conver-
sion. RF frequency coverage is
from 0.8 to 6 GHz and IF coverage
is from 50 to 700 MHz. Packaged
in the SOT-363 package, this
4.0␣ sq. mm. package requires half
the board space of a SOT-143 and
only 15% the board space of an
SO-8 package.
At 1.9 GHz, the IAM-91563 pro-
vides 9 dB of conversion gain,
thus eliminating an RF or IF gain
stage normally needed with a
lossy mixer. LO drive power is
nominally only -5 dBm, eliminat-
ing an LO buffer amplifier. The
8.5 dB noise figure is low enough
to allow the system to use a low
cost LNA. The -6 dBm Input IP3
provides adequate system linearity
for most commercial applications,
but is adjustable to 0 dBm.
The circuit uses GaAs PHEMT
technology with proven reliability,
and uniformity. The MMIC
consists of a cascode FET struc-
ture that provides unbalanced gm
modulation type mixing. An on-
chip LO buffer amp drives the
mixer while bias circuitry allows a
single +3V supply (through a
choked IF port). The LO port is
internally matched to 50 . The
RF and IF ports are high imped-
ance and require external match-
ing networks.
5965-9973E




IAM-91563 pdf, 반도체, 판매, 대치품
IAM-91563 Typical Performance, TC = 25°C, Vd= 3.0 V, RF=1890 MHz, LO = -5 dBm, IF = 250 MHz,
unless otherwise stated.
12 12
12
10 10
10
88
8
6
TA = +85°C
6
TA = 3.3V
6
TA = +85°C
TA = +25°C
TA = 3.0V
TA = +25°C
4
TA = -40°C
4
TA = 2.7V
4
TA = -40°C
2
0 100 200 300 400 500 600 700
IF FREQUENCY (MHz)
Figure 10. SSB Noise Figure vs.
Frequency and Temperature.
2
0 100 200 300 400 500 600 700
IF FREQUENCY (MHz)
Figure 11. Conversion Gain vs.
Frequency and Supply Voltage.
2
0 100 200 300 400 500 600 700
IF FREQUENCY (MHz)
Figure 12. Conversion Gain vs.
Frequency and Temperature.
14
NF
12
10
0
-2
IP3
-4
8 -6
GAIN
6 -8
P1 dB
4
-10 -9 -8 -7 -6 -5 -4 -3 -2 -1
LO POWER (dBm)
Figure 13. Available Conversion Gain
and Noise Figure vs. LO Drive Power.
-10
-10 -9 -8 -7 -6 -5 -4 -3 -2 -1
LO POWER (dBm)
Figure 14. One dB Compression and
Input Third Order Intercept vs. LO
Drive Power.
0
-2 RF-IF
-4
LO-IF
-6
-8
-10 LO-RF
-12
-14
-16
-18
-20
0
12345
RF FREQUENCY (GHz)
6
Figure 15. Isolation (LO-RF, RF-IF,
LO-IF) vs. Frequency with no RF and
IF Matching Networks.
0
-4 RF-LO
-8
-12
-16
-20
-24 RF-IF
-28
-32
-36
-40
0
LO-IF
12345
RF FREQUENCY (GHz)
6
Figure 16. Isolation (RF-LO, RF-IF,
LO-IF) vs. Frequency with RF and IF
Matching Networks.
7-138

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IAM-91563 전자부품, 판매, 대치품
or maximum values. For the
IAM-91563, these parameters are:
Conversion Gain (Gtest), Noise
Figure (NFtest), and Device
Current (Id). Each of these
guaranteed parameters is 100%
tested.
Values for most of the parameters
in the table of Electrical Specifica-
tions that are described by typical
data are the mathematical mean
(µ), of the normal distribution
taken from the characterization
data. For parameters where
measurements or mathematical
averaging may not be practical,
such as the Typical Reflection
Coefficients table or performance
curves, the data represents a
nominal part taken from the
“center” of the characterization
distribution. Typical values are
intended to be used as a basis for
electrical design.
To assist designers in optimizing
not only the immediate circuit
using the IAM-91563, but to also
optimize and evaluate trade-offs
that affect a complete wireless
system, the standard deviation
(σ) is provided for many of the
Electrical Specifications param-
eters (at 25°) in addition to the
mean. The standard deviation is a
measure of the variability about
the mean. It will be recalled that a
normal distribution is completely
described by the mean and
standard deviation.
Standard statistics tables or
calculations provide the probabil-
ity of a parameter falling between
any two values, usually symmetri-
cally located about the mean.
Referring to Figure 12 for ex-
ample, the probability of a param-
eter being between ± 1σ is 68.3%;
between ± 2σ is 95.4%; and be-
tween ± 3σ is 99.7%.
68%
95%
99%
-3σ -2σ -1σ Mean (µ) +1σ +2σ +3σ
(typical)
Parameter Value
Figure 19. Normal Distribution.
Phase Reference Planes
The positions of the reference
planes used to specify Reflection
Coefficients for this device are
shown in Figure 20. As seen in the
illustration, the reference planes
are located at the point where the
package leads contact the test
circuit.
REFERENCE
PLANES
TEST CIRCUIT
Figure20.PhaseReferencePlanes.
RF Layout
An RF layout similar to the one in
Figure 21 is suggested as a
starting point for microstripline
designs using the IAM-91563
mixer. This layout shows the
capacitor for the Source Bypass
pin and the optional resistor used
to increase bias current. Adequate
grounding is important to obtain
maximum performance and to
maintain stability. Both of the
ground pins of the MMIC should
be connected to the RF
groundplane on the backside of
the PCB by means of plated
through holes (vias) that are
placed near the package termi-
nals. As a minimum, one via
should be located next to each of
the ground pins to ensure good RF
grounding. It is a good practice to
use multiple vias to further
minimize ground path inductance.
C
R
Figure21. RFLayout.
It is recommended that the PCB
pads for the ground pins not be
connected together underneath
the body of the package. PCB
traces hidden under the package
cannot be adequately inspected
for SMT solder quality.
PCB Material
FR-4 or G-10 printed circuit board
materials are a good choice for
most low cost wireless applica-
tions. Typical board thickness is
0.020 to 0.031 inches. Thicknesses
greater than 0.031 inch began to
introduce excessive inductance in
the ground vias. The width of the
50 microstriplines on PC boards
in this thickness range is also very
convenient for mounting chip
components such as the series
inductor at the input or DC
blocking and bypass capacitors.
For applications using higher
frequencies such as the 5.8 GHz
ISM band, the additional cost of
PTFE/glass dielectric materials
may be warranted to minimize
transmission line loss at the
mixer’s RF input. An additional
consideration of using lower cost
7-141

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관련 데이터시트

부품번호상세설명 및 기능제조사
IAM-91563

3V Downconverter

AVAGO
AVAGO
IAM-91563

0.8-6 GHz 3V Downconverter

Agilent(Hewlett-Packard)
Agilent(Hewlett-Packard)

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