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MBRB2535CTL 데이터시트 PDF




Motorola Semiconductors에서 제조한 전자 부품 MBRB2535CTL은 전자 산업 및 응용 분야에서
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부품번호 MBRB2535CTL 기능
기능 SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package
제조업체 Motorola Semiconductors
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MBRB2535CTL 데이터시트, 핀배열, 회로
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MBRB2535CTL/D
Designer's Data Sheet
SWITCHMODEPower Rectifier
D2PAK Surface Mount Power Package
MBRB2535CTL
Motorola Preferred Device
The D2PAK Power Rectifier employs the Schottky Barrier principle in a large
metal–to–silicon power diode. State–of–the–art geometry features epitaxial
construction with oxide passivation and metal overlay contact. Ideally suited for
use in low voltage, high frequency switching power supplies, free wheeling
diodes, and polarity protection diodes. These state–of–the–art devices have the
following features:
Center–Tap Configuration
Guardring for Stress Protection
Low Forward Voltage
125°C Operating Junction Temperature
Epoxy Meets UL94, VO at 1/8
Guaranteed Reverse Avalanche
Short Heat Sink Tab Manufactured — Not Sheared!
Similar in Size to the Industry Standard TO–220 Package
1
3
4
SCHOTTKY BARRIER
RECTIFIER
25 AMPERES
35 VOLTS
1
3
4
Mechanical Characteristics
Case: Epoxy, Molded
CASE 418B–02
D2PAK
Weight: 1.7 grams (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
Shipped 50 units per plastic tube
Available in 24 mm Tape and Reel, 800 units per 13reel by adding a “T4” suffix to the part number
Marking: B2535L
MAXIMUM RATINGS (PER LEG)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated VR) TC = 110°C
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 90°C
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
VRRM 35 Volts
VRWM
VR
IF(AV) 12.5 Amps
IFRM
25 Amps
IFSM
150 Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz)
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated VR)
THERMAL CHARACTERISTICS (PER LEG)
IRRM
Tstg
TJ
dv/dt
1.0
– 65 to +150
– 65 to +125
10,000
Amp
°C
°C
V/µs
Thermal Resistance — Junction to Case
— Junction to Ambient (1)
(1) When mounted using minimum recommended pad size on FR–4 board.
RθJC
RθJA
2.0 °C/W
50
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 1
©RMeoctotriofilea,rInDce. 1v9ic96e Data
1




MBRB2535CTL pdf, 반도체, 판매, 대치품
MBRB2535CTL
RECOMMENDED PROFILE FOR REFLOW SOLDERING
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers
these profiles from one operating session to the next. Figure
5 shows a typical heating profile for use when soldering the
D2PAK to a printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material being
used. This profile shows temperature versus time. The line on
the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/in-
frared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177 –189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6 STEP 7
VENT COOLING
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
160°C
170°C
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 5. Typical Solder Heating Profile for D2PAK
4 Rectifier Device Data

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