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PDF MC10H161 Data sheet ( Hoja de datos )
| Número de pieza | MC10H161 | |
| Descripción | Binary to 1-8 Decoder(Low) | |
| Fabricantes | ON Semiconductor | |
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MC10H161
Binary to 1−8 Decoder
(Low)
Description
The MC10H161 provides parallel decoding of a three bit binary
word to one of eight lines. The MC10H161 is useful in high−speed
multiplexer/demultiplexer applications.
The MC10H161 is designed to decode a three bit input word to one
of eight output lines. The MC10H161 output will be low when
selected while all other output are high. The enable inputs, when either
or both are high, force all outputs high.
The MC10H161 is a true parallel decoder. This eliminates unequal
parallel path delay times found in other decoder designs. These
devices are ideally suited for multiplexer/demultiplexer applications.
Features
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 315 mW Typical (same as MECL 10K™)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K Compatible
• Pb−Free Packages are Available*
DIP PIN ASSIGNMENT
http://onsemi.com
MARKING DIAGRAMS*
CDIP−16
L SUFFIX
CASE 620A
16
MC10H161L
AWLYYWW
1
16
16
1
PDIP−16
P SUFFIX
CASE 648
MC10H161P
AWLYYWWG
1
VCC1 1 16 VCC2
E0 2 15 E1
Q3
3
14
C
Pin assignment is for Dual−in−Line
Package. For PLCC pin assignment, see
Q2 4 13 Q4 the Pin Conversion Tables on page 18 of
Q1 5 12 Q5
Q0 6 11 Q6
the ON Semiconductor MECL Data
Book (DL122/D).
A 7 10 Q7
VEE 8
9B
LOGIC DIAGRAM
E0 2
E1 15
VCC1 = Pin 1
VCC2 = Pin 16
VEE = Pin 8
A7
B9
6 Q0 ENABLE
INPUTS
5 Q1 E1 E0
4 Q2
3 Q3
13 Q4
12 Q5
L
L
L
L
L
L
L
L
H
X
L
L
L
L
L
L
L
L
X
H
TRUTH TABLE
INPUTS
OUTPUTS
C B A Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
L L L L HH H H HH H
L L H H L H H H HH H
L H L H H L H H HH H
L HH H HH L H HH H
H L L H HH H L HH H
H L HH HHHH LHH
HHL H HHHH HL H
H HH H HH H H HH L
X X X H HH H H HH H
X X X H HH H H HH H
11 Q6
SOEIAJ−16
CASE 966
10H161
ALYWG
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
10H161G
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
C 14
10 Q7
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
Publication Order Number:
MC10H161/D
1 page  
−L−
20
MC10H161
PACKAGE DIMENSIONS
−N− Y BRK
−M−
W
1
V
20 LEAD PLLC
CASE 775−02
ISSUE E
B 0.007 (0.180) M T L−M S N S
U 0.007 (0.180) M T L−M S N S
D
Z
D X G1 0.010 (0.250) S T L−M S N S
VIEW D−D
A 0.007 (0.180) M T L−M S N S
Z
R 0.007 (0.180) M T L−M S N S
H 0.007 (0.180) M T L−M S N S
CE
K1
0.004 (0.100)
G J −T− SEATING
PLANE
VIEW S
G1
K
F
VIEW S
0.007 (0.180) M T L−M S N S
0.010 (0.250) S T L−M S N S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
INCHES
DIM MIN MAX
A 0.385 0.395
B 0.385 0.395
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G 0.050 BSC
H 0.026 0.032
J 0.020 −−−
K 0.025 −−−
R 0.350 0.356
U 0.350 0.356
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y −−− 0.020
Z 2 _ 10 _
G1 0.310 0.330
K1 0.040 −−−
MILLIMETERS
MIN MAX
9.78 10.03
9.78 10.03
4.20 4.57
2.29 2.79
0.33 0.48
1.27 BSC
0.66 0.81
0.51 −−−
0.64 −−−
8.89 9.04
8.89 9.04
1.07 1.21
1.07 1.21
1.07 1.42
−−− 0.50
2 _ 10 _
7.88 8.38
1.02 −−−
http://onsemi.com
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