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PDF PHP24N03LT Data sheet ( Hoja de datos )

Número de pieza PHP24N03LT
Descripción TrenchMOS transistor Logic level FET
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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Philips Semiconductors
TrenchMOStransistor
Logic level FET
Product specification
PHP24N03LT, PHB24N03LT
FEATURES
’Trench’ technology
• Very low on-state resistance
• Fast switching
• Stable off-state characteristics
• High thermal cycling performance
• Low thermal resistance
SYMBOL
g
d
s
QUICK REFERENCE DATA
VDSS = 30 V
ID = 24 A
RDS(ON) 56 m(VGS = 5 V)
RDS(ON) 50 m(VGS = 10 V)
GENERAL DESCRIPTION
N-channel enhancement mode logic level field-effect power transistor in a plastic envelope using ’trench’ technology.
The device has very low on-state resistance. It is intended for use in dc to dc converters and general purpose switching
applications.
The PHP24N03LT is supplied in the SOT78 (TO220AB) conventional leaded package.
The PHB24N03LT is supplied in the SOT404 surface mounting package.
PINNING
PIN DESCRIPTION
1 gate
SOT78 (TO220AB)
tab
SOT404
tab
2 drain1
3 source
tab drain
1 23
2
13
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
VDSS
VDGR
VGS
ID
IDM
PD
Tj, Tstg
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Continuous drain current
Pulsed drain current
Total power dissipation
Operating junction and
storage temperature
Tj = 25 ˚C to 175˚C
Tj = 25 ˚C to 175˚C; RGS = 20 k
Tmb = 25 ˚C; VGS = 5 V
Tmb = 100 ˚C; VGS = 5 V
Tmb = 25 ˚C
Tmb = 25 ˚C
MIN.
-
-
-
-
-
-
-
- 55
MAX.
30
30
± 13
24
20
96
60
175
UNIT
V
V
V
A
A
A
W
˚C
1 It is not possible to make connection to pin 2 of the SOT404 package.
January 1998
1
Rev 1.300

1 page




PHP24N03LT pdf
Philips Semiconductors
TrenchMOStransistor
Logic level FET
Product specification
PHP24N03LT, PHB24N03LT
a
2
30V TrenchMOS
1.5
1
0.5
0
-100
-50
0 50 100 150 200
Tj / C
Fig.9. Normalised drain-source on-state resistance.
a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 12 A; VGS = 5 V
VGS(TO) / V
2.5
max.
2
typ.
1.5
min.
1
BUK959-60
0.5
0
-100
-50
0 50
Tj / C
100 150 200
Fig.10. Gate threshold voltage.
VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS
1E-01
Sub-Threshold Conduction
1E-02
1E-03
2% typ 98%
1E-04
1E-05
1E-05
0 0.5 1 1.5 2 2.5
Fig.11. Sub-threshold drain current.
ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS
3
Capacitances Ciss, Coss, Crss (pF)
1000
PHP24N03LT
Ciss
100 Coss
Crss
Tj = 25 C
10
1
10 100
Drain-source voltage, VDS (V)
1000
Fig.12. Typical capacitances, Ciss, Coss, Crss.
C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
VGS, Gate-Source voltage (Volts)
15
VDD = 30 V
ID = 10 A
Tj = 25 C
10
PHP24N03LT
5
0
0 5 10 15 20 25
Qg, Gate charge (nC)
Fig.13. Typical turn-on gate-charge characteristics.
VGS = f(QG); parameter VDS
Source-Drain diode current, IF(A)
20
VGS = 0 V
15
PHP24N03LT
10
175 C
Tj = 25 C
5
0
0 0.2 0.4 0.6 0.8 1 1.2 1.4
Source-Drain voltage, VSDS (V)
Fig.14. Typical reverse diode current.
IF = f(VSDS); parameter Tj
January 1998
5
Rev 1.300

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