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PDF MCRF360 Data sheet ( Hoja de datos )
| Número de pieza | MCRF360 | |
| Descripción | 13.56 MHz Passive RFID Device with Anti-Collision Feature | |
| Fabricantes | Microchip Technology | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MCRF360 (archivo pdf) en la parte inferior de esta página. Total 23 Páginas | ||
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MCRF355/360
13.56 MHz Passive RFID Device with Anti-Collision Feature
Features
• Carrier frequency: 13.56 MHz
• Data modulation frequency: 70 kHz
• Manchester coding protocol
• 154 bits of user memory
• On-board 100 ms SLEEP timer
• Built-in anti-collision algorithm for reading up to
multiple tags in the same RF field
• “Cloaking” feature to minimize the detuning
effects of adjacent tags
• Internal 100 pF resonant capacitor (MCRF360)
• Read only device in RF field
• Long read range
• Rewritable with contact programmer or factory-
programmed options
• Very low power CMOS design
• Die, wafer, bumped wafer, COB, PDIP or SOIC
package options
Application
• Book store and library book ID
• Airline baggage tracking
• Toys and gaming tools
• Access control/asset tracking
• Applications for reading multiple tags and long
read range
Reader
RF Carrier
Modulated
RF Data
Ant. A
MCRF355/360
Ant. B
Vss
Read range: ~ up to 1.5 meters depending on tag size
and system requirements.
Package Type
PDIP/SOIC
VPRG
CLK
Ant. A
NC
1
2
3
4
8 VDD
7 NC
6 Ant. B
5 VSS
Note:
Pins 1, 2, 5 and 8 are for device testing
and contact programming.
Pins 3, 5 and 6 are for external antenna
connection.
NC = Not connected
MCRF355 COB
5 mm
Thickness = 0.4 mm
2002 Microchip Technology Inc.
DS21287F-page 1
1 page  
MCRF355/360
TABLE 1-4: PAD COORDINATES (MICRONS)
Pad Name
Lower Lower Upper
Left X Left Y Right X
Upper
Right Y
Passivation Openings
Pad Width
Pad Height
Pad Pad
Center X Center Y
Ant. A
-610.0 489.2 -521.0 578.2
89
89 -565.5 533.7
Ant. B
-605.0 -579.8 -516.0 -490.8
89
89 -560.5 -535.3
VSS -605.0 -58.2 -516.0 30.8
89
89 -560.5 -13.7
VDD 463.4 -181.4 552.4 -92.4
89
89 507.9 -136.9
CLK 463.4 496.8 552.4 585.8
89
89 507.9 541.3
VPRG
463.4 157.6 552.4 246.6
89
89 507.9 202.1
Note 1: All coordinates are referenced from the center of the die. The minimum distance between pads (edge to
edge) is 10 mil.
2: Die Size = 1.417 mm x 1.513 mm = 1417 µm x 1513 µm = 55.79 mil x 59.57 mil
FIGURE 1-1:
DIE LAYOUT
Y (Notch edge of wafer)
Ant A
x
458.4
VSS x
432.6
Ant B
x
1162.4
1157.4
1417
x CLK
250.2
x
250
VPRG
X
x VDD
Die size before saw:
1417 µm x 1513 µm
55.79 mil x 59.57 mil
Die size after saw:
1353.8 µm x 1450.34 µm
53.3 x 57.1 mil
Bond pad size:
89 µm x 89 µm
3.5 mil x 3.5 mil
2002 Microchip Technology Inc.
DS21287F-page 5
5 Page 
MCRF355/360
EXAMPLE 4-3:
CLK Number:
CLK:
PROGRAMMING MODE 3: READ EE
12 56 7 8 9
10 11 12
165
VPRG:
VIL
VIH…
bit #0 bit #1 ... bit #153
data data
Turn off programmer drive during
data
CLK high so MCRF355 can drive
VPRG.
EXAMPLE 4-4:
TIMING DATA
THIGH TLOW
CLK:
VPRG:
VHH
VIH
VIL
THD:DAT
VPRG:
(Reading)
TSU:DAT
VHH
VIH…
VIL
TPW:STO
TAA
TSU:HH
TWC
TSU:STO
TDL:HH
2002 Microchip Technology Inc.
DS21287F-page 11
11 Page | ||
| Páginas | Total 23 Páginas | |
| PDF Descargar | [ Datasheet MCRF360.PDF ] | |
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