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MCR08BT1 데이터시트 PDF




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MCR08BT1 데이터시트, 핀배열, 회로
MCR08B, MCR08M
Preferred Device
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
PNPN devices designed for line powered consumer applications
such as relay and lamp drivers, small motor controls, gate drivers for
larger thyristors, and sensing and detection circuits. Supplied in
surface mount package for use in automated manufacturing.
Sensitive Gate Trigger Current
Blocking Voltage to 600 Volts
Glass Passivated Surface for Reliability and Uniformity
Surface Mount Package
Device Marking: MCR08BT1: CR08B; MCR08MT1: CR08M, and
Date Code
http://onsemi.com
SCRs
0.8 AMPERES RMS
200 thru 600 VOLTS
G
AK
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
Peak Repetitive Off–State Voltage(1)
(Sine Wave, RGK = 1000 ,
TJ = 25 to 110°C)
MCR08BT1
MCR08MT1
VDRM,
VRRM
200
600
Unit
Volts
On-State Current RMS
IT(RMS) 0.8 Amps
(All Conduction Angles; TC = 80°C)
Peak Non-repetitive Surge Current
(1/2 Cycle Sine Wave, 60 Hz,
TC = 25°C)
Circuit Fusing Considerations
(t = 8.3 ms)
ITSM
I2t
8.0 Amps
0.4 A2s
Forward Peak Gate Power
(TC = 80°C, t = 1.0 µs)
Average Gate Power
(TC = 80°C, t = 8.3 ms)
Operating Junction Temperature Range
PGM
PG(AV)
TJ
0.1
0.01
– 40 to
+110
Watts
Watts
°C
Storage Temperature Range
Tstg
– 40 to
°C
+150
(1) VDRM and VRRM for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant source such that the voltage
ratings of the devices are exceeded.
4
12 3
SOT–223
CASE 318E
STYLE 10
PIN ASSIGNMENT
1 Cathode
2 Anode
3 Gate
4 Anode
ORDERING INFORMATION
Device
Package
Shipping
MCR08BT1
SOT223 16mm Tape and Reel
(1K/Reel)
MCR08MT1
SOT223 16mm Tape and Reel
(1K/Reel)
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 3
1
Publication Order Number:
MCR08BT1/D




MCR08BT1 pdf, 반도체, 판매, 대치품
MCR08B, MCR08M
10
1.0
0.1
0.01
0
TYPICAL AT TJ = 110°C
MAX AT TJ = 110°C
MAX AT TJ = 25°C
1.0 2.0 3.0 4.0
vT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
Figure 2. On-State Characteristics
110
100
90
80
70
60
50
40
30
20
0
α = 30°
60°
50 OR 60 Hz HALFWAVE
α
α = CONDUCTION
ANGLE
dc
180°
120°
90°
0.1 0.2 0.3 0.4
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
0.5
Figure 4. Current Derating, Minimum Pad Size
Reference: Ambient Temperature
110 PAD AREA = 4.0 cm2, 50
100 dc OR 60 Hz HALFWAVE
90 180°
80 α = 30°
120°
60°
70
90°
60 α
α = CONDUCTION
ANGLE
50
0 0.1
0.2
0.3 0.4
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
0.5
Figure 6. Current Derating, 2.0 cm Square Pad
Reference: Ambient Temperature
160
150 TYPICAL
140 MAXIMUM
130
120
110
DEVICE MOUNTED ON
FIGURE 1 AREA = L2
PCB WITH TAB AREA
100 AS SHOWN
90
80
70
60
50 MINIMUM
40 FOOTPRINT = 0.076 cm2
30
0 1.0 2.0 3.0 4.0 5.0 6.0
FOIL AREA (cm2)
L
L
4
123
7.0 8.0 9.0 10
Figure 3. Junction to Ambient Thermal
Resistance versus Copper Tab Area
110 1.0 cm2 FOIL, 50 OR
100 60 Hz HALFWAVE
dc
90
180°
80
120°
70
60 α = 30°
50 60°
40 90°
α
30 α = CONDUCTION
ANGLE
20
0 0.1 0.2 0.3 0.4
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
0.5
Figure 5. Current Derating, 1.0 cm Square Pad
Reference: Ambient Temperature
110
α = 30°
dc 50 OR 60 Hz HALFWAVE
180°
120°
60°
α
α = CONDUCTION
ANGLE
85
0 0.1
90°
0.2 0.3
0.4
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
Figure 7. Current Derating
Reference: Anode Tab
0.5
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MCR08BT1 전자부품, 판매, 대치품
MCR08B, MCR08M
INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.079
2.0
0.15
3.8
0.091
2.3
0.091
2.3
0.079
2.0
0.059
1.5
0.059
1.5
0.059
1.5
SOT-223
0.248
6.3
inches
mm
SOT-223 POWER DISSIPATION
The power dissipation of the SOT-223 is a function of the
anode pad size. This can vary from the minimum pad size
for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the SOT-223 package, PD can be calculated as
follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 550 milliwatts.
PD = 110°C – 25°C = 550 milliwatts
156°C/W
The 156°C/W for the SOT-223 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 550
milliwatts. There are other alternatives to achieving higher
power dissipation from the SOT-223 package. One is to
increase the area of the anode pad. By increasing the area of
the anode pad, the power dissipation can be increased.
Although one can almost double the power dissipation with
this method, one will be giving up area on the printed
circuit board which can defeat the purpose of using surface
mount technology. A graph of RθJA versus anode pad area
is shown in Figure 3.
Another alternative would be to use a ceramic substrate
or an aluminum core board such as Thermal Clad. Using
a board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SOT-223 package should
be the same as the pad size on the printed circuit board, i.e.,
a 1:1 registration.
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부품번호상세설명 및 기능제조사
MCR08BT1

SCR 0.8 AMPERE RMS 200 thru 600 Volts

Motorola Semiconductors
Motorola Semiconductors
MCR08BT1

SENSITIVE GATE SILICON CONTROLLED RECTIFIERS

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