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PDF MMBFJ177LT1 Data sheet ( Hoja de datos )

Número de pieza MMBFJ177LT1
Descripción JFET Chopper
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MMBFJ177LT1
JFET Chopper
P−Channel − Depletion
Features
Pb−Free Package is Available
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Drain−Gate Voltage
VDG 25 Vdc
Reverse Gate−Source Voltage
VGS(r) −25 Vdc
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
THERMAL CHARACTERISTICS
Total Device Dissipation FR− 5 Board
(Note 1)
TA = 25°C
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
1. FR−5 = 1.0  0.75  0.062 in.
PD 225 mW
1.8 mW/°C
RqJA
556 °C/W
TJ, Tstg − 55 to +150 °C
http://onsemi.com
3
GATE
2 SOURCE
1 DRAIN
3
1
2
SOT−23 (TO−236AB)
CASE 318−08
STYLE 10
MARKING DIAGRAM
6Y MG
G
1
6Y = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
MMBFJ177LT1
SOT−23 3000 Tape & Reel
MMBFJ177LT1G SOT−23 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
November, 2005 − Rev. 3
1
Publication Order Number:
MMBFJ177LT1/D

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