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PDF MMDT3906 Data sheet ( Hoja de datos )
| Número de pieza | MMDT3906 | |
| Descripción | DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR | |
| Fabricantes | Diodes Incorporated | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MMDT3906 (archivo pdf) en la parte inferior de esta página. Total 4 Páginas | ||
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MMDT3906
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Ideal for Low Power Amplification and Switching
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
Mechanical Data
A
C2 B1 E1
BC
E2 B2 C1
• Case: SOT-363
H
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
K
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208 J D F
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
C2 B1 E1
• Terminal Connections: See Diagram
• Ordering and Date Code Information: See Page 4
• Marking Information: K3N, See Page 4
• Weight: 0.006 grams (approximate)
E2 B2 C1
L
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
F 0.30 0.40
M H 1.80 2.20
J — 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.25
α 0° 8°
All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 1)
Symbol
VCBO
VCEO
VEBO
IC
Pd
RθJA
Tj, TSTG
Value
-40
-40
-5.0
-200
200
625
-55 to +150
Unit
V
V
V
mA
mW
°C/W
°C
Notes:
1. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30124 Rev. 11 - 2
1 of 4
www.diodes.com
MMDT3906
© Diodes Incorporated
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet MMDT3906.PDF ] | |
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