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PDF MMDT4126 Data sheet ( Hoja de datos )

Número de pieza MMDT4126
Descripción DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Fabricantes Diodes Incorporated 
Logotipo Diodes Incorporated Logotipo



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No Preview Available ! MMDT4126 Hoja de datos, Descripción, Manual

Features
Epitaxial Planar Die Construction
Complementary NPN Type Available (MMDT4124)
Ideal for Medium Power Amplification and Switching
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
Mechanical Data
Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
Terminal Connections: See Diagram
Marking Information: K2B, See Page 3
Ordering & Date Code Information: See Page 3
Weight: 0.006 grams (approximate)
MMDT4126
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
A
C2 B1 E1
BC
E2 B2 C1
G
H
K
J
DF
L
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
F 0.30 0.40
H 1.80 2.20
M J — 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.25
α 0° 8°
All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current – Continuous
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 1)
(Note 1,2)
(Note 1)
Symbol
VCBO
VCEO
VEBO
IC
Pd
RθJA
Tj, TSTG
Value
-25
-25
-4.0
-200
200
625
-55 to +150
Unit
V
V
V
mA
mW
°C/W
°C
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30160 Rev. 9 - 2
1 of 4
www.diodes.com
MMDT4126
© Diodes Incorporated

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