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PDF MMDT4146 Data sheet ( Hoja de datos )
| Número de pieza | MMDT4146 | |
| Descripción | COMPLEMENTARY NPN/PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR | |
| Fabricantes | Diodes Incorporated | |
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MMDT4146
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Complementary Pair
One 4124-Type NPN
One 4126-Type PNP
• Epitaxial Planar Die Construction
• Ideal for Medium Power Amplification and Switching
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.006 grams (approximate)
C2 B1 E1
E1, B1, C1 = PNP4126 Section
E2, B2, C2 = NPN4124 Section
Top View
E2 B2 C1
Device Schematic
Maximum Ratings, NPN 4124 Section @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current – Continuous
(Note 1)
Symbol
VCBO
VCEO
VEBO
IC
Value
30
25
5.0
200
Unit
V
V
V
mA
Maximum Ratings, PNP 4126 Section @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
(Note 1)
Symbol
VCBO
VCEO
VEBO
IC
Value
-25
-25
-4
-200
Unit
V
V
V
mA
Thermal Characteristics – Total Device
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
(Note 1, 2)
(Note 1)
Symbol
PD
RθJA
Value
200
625
Unit
mW
°C/W
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMDT4146
Document number: DS30162 Rev. 11 - 2
1 of 5
www.diodes.com
January 2009
© Diodes Incorporated
1 page  
Package Outline Dimensions
A
BC
H
K
J
DF
L
M
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Typ
F 0.40 0.45
H 1.80 2.20
J 0 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.22
α 0° 8°
All Dimensions in mm
MMDT4146
Suggested Pad Layout
C2 C2
G
Z
Y
X
C1
Dimensions
Z
G
X
Y
C1
C2
Value (in mm)
2.5
1.3
0.42
0.6
1.9
0.65
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
MMDT4146
Document number: DS30162 Rev. 11 - 2
5 of 5
www.diodes.com
January 2009
© Diodes Incorporated
5 Page | ||
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| PDF Descargar | [ Datasheet MMDT4146.PDF ] | |
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