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PDF MMDT4401 Data sheet ( Hoja de datos )
| Número de pieza | MMDT4401 | |
| Descripción | DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR | |
| Fabricantes | Diodes Incorporated | |
| Logotipo |  |
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MMDT4401
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Ideal for Low Power Amplification and Switching
• Ultra-Small Surface Mount Package
• Qualified to AEC-Q101 Standards for High Reliability
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Terminal Connections: See Diagram
• Marking Information: K2X – See Page 4
• Ordering & Date Code Information: See Page 4
• Weight: 0.006 grams (approximate)
A
C2 B1 E1
BC
E2 B2 C1
H
K
J DF
C2 B1 E1
L
E2 B2 C1
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
F 0.30 0.40
M H 1.80 2.20
J — 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.25
α 0° 8°
All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 1)
(Note 1, 2)
(Note 1)
Symbol
VCBO
VCEO
VEBO
IC
Pd
RθJA
Tj, TSTG
Value
60
40
6.0
600
200
625
-55 to +150
Unit
V
V
V
mA
mW
°C/W
°C
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30111 Rev. 13 - 2
1 of 4
www.diodes.com
MMDT4401
© Diodes Incorporated
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet MMDT4401.PDF ] | |
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