PDF MMST4124 Data sheet ( Hoja de datos )

Número de pieza	MMST4124
Descripción	NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Fabricantes	Diodes Incorporated
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No Preview Available ! Features • Epitaxial Planar Die Construction • Complementary PNP Type Available (MMST4126) • Ideal for Medium Power Amplification and Switching • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 2) • "Green" Device (Notes 3 and 4) MMST4124 NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR Mechanical Data • Case: SOT-323 • Case Material: Molded Plastic, "Green" Molding Compound, Note 4. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminal Connections: See Diagram • Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating) Solderable per MIL-STD-202, Method 208 • Marking Information: See Page 3 • Ordering Information: See Page 3 • Weight: 0.006 grams (approximate) C Top View Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous (Note 1) BE Device Schematic Symbol VCBO VCEO VEBO IC Value 30 25 5.0 200 Unit V V V mA Thermal Characteristics Characteristic Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Value 200 625 -55 to +150 Unit mW οC/W °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic OFF CHARACTERISTICS (Note 5) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current ON CHARACTERISTICS (Note 5) DC Current Gain Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Output Capacitance Input Capacitance Small Signal Current Gain Current Gain-Bandwidth Product Symbol Min V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO 30 25 5.0 ⎯ ⎯ hFE VCE(SAT) VBE(SAT) 120 60 ⎯ ⎯ Cobo Cibo hfe fT ⎯ ⎯ 120 300 Max ⎯ ⎯ ⎯ 50 50 360 ⎯ 0.30 0.95 4.0 8.0 480 ⎯ Unit Test Condition V IC = 10μA, IE = 0 V IC = 1.0mA, IB = 0 V IE = 10μA, IC = 0 nA VCB = 20V, IE = 0V nA VEB = 3.0V, IC = 0V ⎯ IC = 2.0mA, VCE = 1.0V IC = 50mA, VCE = 1.0V V IC = 50mA, IB = 5.0mA V IC = 50mA, IB = 5.0mA pF pF ⎯ MHz VCB = 5.0V, f = 1.0MHz, IE = 0 VEB = 0.5V, f = 1.0MHz, IC = 0 VCE = 1.0V, IC = 2.0mA, f = 1.0kHz VCE = 20V, IC = 10mA, f = 100MHz Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. No purposefully added lead. 3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 5. Short duration pulse test used to minimize self-heating effect. MMST4124 Document number: DS30163 Rev. 9 - 2 1 of 3 www.diodes.com January 2009 © Diodes Incorporated 1 page

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Número de pieza	Descripción	Fabricantes
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