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기능 POWER OPERATIONAL AMPLIFIERS
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P03A 데이터시트, 핀배열, 회로
MICROTECHNOLOGY
POWER OPERATIONAL AMPLIFIERS
PA03 • P03A
HTTP://WWW.APEXMICROTECH.COM (800) 546-APEX (800) 546-2739
FEATURES
• MO-127 COPPER POWER DIP™ PACKAGE
• HIGH INTERNAL POWER DISSIPATION
— 500 watts
• HIGH VOLTAGE OPERATION — ±75V
• VERY HIGH CURRENT — ±30 amps
• INTERNAL SOA PROTECTION
• OUTPUT SWINGS CLOSE TO SUPPLY RAILS
• EXTERNAL SHUTDOWN CONTROL
APPLICATIONS
• LINEAR AND ROTARY MOTOR DRIVES
• YOKE/MAGNETIC FIELD DEFLECTION
• PROGRAMMABLE POWER SUPPLIES to ±68V
• TRANSDUCER/AUDIO TO 1000W
DESCRIPTION
The super power PA03 advances the state of the art in both
brute force power and self protection against abnormal oper-
ating conditions. Its features start with a copper dip package
developed by Apex to extend power capabilities well beyond
those attainable with the familiar TO-3 package. The in-
creased pin count of the new package provides additional
control features, while the superior thermal conductivity of
copper allows substantially higher power ratings.
The PA03 incorporates innovative current limiting circuits
limiting internal power dissipation to a curve approximating the
safe operating area of the power transistors. The internal
current limit of 35A is supplemented with thermal sensing
which reduces the current limit as the substrate temperature
rises. Furthermore, a subcircuit monitors actual junction tem-
peratures and with a response time of less than ten millisec-
onds reduces the current limit further to keep the junction
temperature at 175°C.
The PA03 also features a laser trimmed high performance
FET input stage providing superior DC accuracies both initially
and over the full temperature range.
TYPICAL APPLICATION
+VS
POSITION
FEEDBACK
+5V
RBAL
+
+S
OBJECT
TOOL
SHUT DOWN
0/10V
DAC
R1
DESIRED
POSITION
–S PA03
–VS
C1
R2
The PA03 output power stages contain fast reverse recov-
ery diodes for sustained high energy flyback protection.
This hybrid integrated circuit utilizes thick film resistors,
ceramic capacitors and silicon semiconductors to maximize
reliability, minimize size and give top performance. Ultrasoni-
cally bonded aluminum wires provide reliable interconnec-
tions at all operating temperatures. The MO-127 Copper,
12-pin Power Dip™ package (see Package Outlines), is
hermetically sealed and isolated from the internal circuits.
Insulating washers are not recommended.
IMPORTANT: Observe mounting precautions.
EQUIVALENT
SCHEMATIC
8 +V
BAL
11
12 BAL
Q2
Q3
D1
Q12
Q5 4 Q14
+SHUT
Q17 Q18 DOWN
1
Q20 Q20
AB
Q22
3
–SHUT
+ DOWN
2 Q31
9
COMP
10
5 –V
D4
Q1
Q6 Q7
Q4
Q19
Q29 Q30
Q34
Q9 D2
Q16
Q24
+
7
OUT
6
D3
Q32 Q26
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL [email protected]




P03A pdf, 반도체, 판매, 대치품
PA03 • PA03A
OPERATING
CONSIDERATIONS
GENERAL
Please read the “General Operating Considerations” section,
which covers stability, supplies, heatsinking, mounting, current
limit, SOA interpretation, and specification interpretation. Addi-
tional information can be found in the application notes. For
information on the package outline, heatsinks, and mounting
hardware, consult the “Accessory and Package Mechanical Data”
section of the handbook.
MOUNTING PRECAUTIONS
The PA03 copper base is very soft and easily bent. Do not put
any stress on the mounting ears of this package. This calls for
caution when pushing the amplifier into certain types of packaging
foam and particularly when inserting the device into a socket.
Insert the amplifier into the socket only by pushing on the perimeter
of the package lid. Pushing the unit into the socket by applying
pressure to the mounting tabs will bend the base due to the high
insertion force required. The base will then not contact the heatsink
evenly resulting in very poor heat transfer. To remove a unit from
a socket, pry the socket away from the heatsink so that the
heatsink will support the amplifier base evenly. Recommended
mounting torque is 8–10 in.-lbs. (.9–1.13 N•m).
SAFE OPERATING AREA (SOA)
Due to the internal (non-adjustable) current limit of the PA03,
worst case power dissipation calculations must assume current
capability of 46 amps. Application specific circuits should be
checked against the SOA curve when relying upon current limit for
fault protection.
SAFE OPERATING AREA CURVES
Second breakdown limitations do apply to the PA03 but are
less severe, since junction temperature limiting responds
within 10ms. Stress levels shown as being safe for more than
10ms duration
will merely
cause thermal
shutdown.
Under nor-
mal operating
conditions, ac-
40
30
10
THERMAL
CURRENT LIMIT ZONE
100mS
1.0mS
10mS
dc
tivation of the 5
thermal shut-
down is a sign
that the inter-
TC = 25°C
nal junction
temperatures
have reached
approximately
1
10 20
50 100 150
SUPPLY TO OUTPUT DIFFERENTIAL VS –VO (V)
175°C. Thermal shutdown is a short term safety feature. If the
conditions remain that cause thermal shutdown, the amplifier
will oscillate in and out of shutdown, creating peak high power
stresses, destroying useful signals, and reducing the reliability
of the device.
BALANCE CONTROL
The voltage offset of the PA03 may be externally adjusted to
zero. To implement this adjustment install a 100 to 200 ohm
potentiometer between pins 11 and 12 and connect the wiper arm
to the positive supply. Bypass pins 11 and 12 each with at least a
.01µF ceramic capacitor.
If the optional adjust provision is not used, connect both pins 11
and 12 to the positive supply.
OUTPUT STAGE SHUTDOWN
The entire power stage of the PA03 may be disabled using one
of the circuits shown in Figure 1. There are many applications for
this function. One is a load protection based on power delivered to
the load or thermal rise. Another one is conservation of power
when using batteries. The control voltage requirements accom-
modate a wide variety logic drivers.
1. CMOS operating at +5V can drive the control pins directly.
2. CMOS operating at greater than 5V supplies need a voltage
divider.
3. TTL logic needs a pull up resistor to +5V to provide a swing to
the fully disabled voltage (3.5V). When not using the shutdown
feature, connect both pins 3 and 4 to common.
PHASE COMPENSATION
At low gain settings an external compensation capacitor is
required to insure stability. In addition to the resistive feedback
network, roll off or integrating capacitors must also be considered.
A frequency of 1 MHz is most appropriate to calculate gain.
Operation at gains below 10, without the external compensation
capacitor opens the possibility of oscillations near output satura-
tion regions when under load, the improper operation of the
thermal shutdown circuit. This can result in amplifier destruction.
At gains of 10 or more:
1. No external components are required.
2. Typical slew rate will be 8V/µs.
3. Typical phase margin will be 70°.
At a gain of 3:
1. Connect a 470pF compensation capacitor between pins 9 and
10.
2. Typical slew rate will be 5V/µs.
3. Typical phase margin will be 45°.
At unity gain:
1. Connect a 1.8nF compensation capacitor between pins 9 and
10.
2. Typical slew rate will be 1.8V/µs.
3. Typical phase margin will be 65°.
FIGURE 1a.
DIRECT DRIVE
OF SHUTDOWN
0 = OPERATE
1 = SHUT DN
+5V
1K
*
PA03
500
4 Q14
500
3
1K
Q22
* NOT REQUIRED
WHEN USING
CMOS LOGIC
+15V
0 = SHUT DN
1 = OPERATE CMOS
FIGURE 1b.
HIGH VOLTAGE
LOGIC INTERFACE
2R
R
500
4
PA03
Q14
500
3
1K
Q22
FIGURE 1c.
THERMALLY
ACTIVATED
SHUTDOWN
+VS
R1
**
** SELECT SHUTOFF
TEMPERATURE
SELECT R4 FOR 5V
DROP ON R2
360–
400mV
R3
360
500
4
R2
4.7K
R4
30K
500
3
Q14
1K
Q22
THERMAL SENSE
TRANSISTOR
PA03
LOAD
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
PA03U REV. I FEBRUARY 1998 © 1998 Apex Microtechnology Corp.

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