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UATM30M2C 데이터시트 PDF




Centellax에서 제조한 전자 부품 UATM30M2C은 전자 산업 및 응용 분야에서
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부품번호 UATM30M2C 기능
기능 0.04-30GHz Broadband MMIC Low Noise Amplifier
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UATM30M2C 데이터시트, 핀배열, 회로
UATM30M2C Datasheet
CENTELLAX
0.04 - 30GHz Broadband MMIC
Low-Noise Amplifier
Application
The UATM30M2C Broadband MMIC Low-Noise
Amplifier is designed for low-noise and broadband
flat-gain applications in RF and microwave commu-
nications, test equipment and military systems. By
using specific external components, the bandwidth
of operation can be extended below 40MHz.
Description
The UATM30M2C is an eight stage traveling wave
amplifier. The amplifier has been designed for low
noise, flat gain, and good return loss to 30GHz. The
amplifier typically has 2.5dB NF and 18dB gain from
6-20GHz, and 16dB gain from 0.04-30GHz.
Features
The UATM30M2C has >30dB dynamic gain control,
and includes a temperature-referenced power detec-
tor output.
Device Highlights
Low noise, ultra-flat gain 6-20GHz:
2.5dB NF, 18 ± 0.3dB gain
Excellent 1.5-20GHz performance:
Very flat gain (18 ± 0.6dB)
High Psat at 20GHz (20dBm)
High P-1dB at 20GHz (17dBm)
Wideband operation: 0.04-30GHz
Good input / output return loss
High isolation
>30dB dynamic gain control
Integrated power detector
100% DC, RF, and visually tested
Size: 2390x920um (94.1x36.2mil)
Key Specifications
Vdd=5.0V, Idd=150mA, Zo=50
Specifications pertain to wafer measurements with RF probes and DC bias cards @ 25°C
6 - 20GHz
1.5 - 20GHz
0.04 - 30GHz
Parameter
Description
Min Typ Max
Min Typ Max
Min Typ Max
S21 (dB)
Flatness (±dB)
S11 (dB)
S22 (dB)
S12 (dB)
Small Signal Gain
Gain Flatness
Input Match
Output Match
Reverse Isolation
16.5 18
0.3
-16
-18
-35
0.6
-13
-15
-30
16.5 18
0.6
-16
-18
-35
1.0
-13
-15
-30
14.5 16
1.5
-10
-18
-30
2.0
-8
-15
-25
P-1dB (dBm)
1dB Compressed Output Power
Psat (dBm)
Saturated Output Power
Pout @16dB (dBm) Output Power at 16dB Gain
NF (dB)
Noise Figure
16 17
19 20
17 18.5
2.5
16 17
19 20
17 18.5
5
12 13.5
14 16.5
5.5
RFdet (mV/mW) RF Detector Sensitivity
0.5
0.5
0.5
CENTELLAX • Web: http://www.centellax.com/ • Email: [email protected] • Tel: 866.522.6888 • Fax: 707.568.7647
Specifications subject to change without notice. Copyright © 2001-2004 Centellax, Inc. Printed in USA. 10 Aug 2004.




UATM30M2C pdf, 반도체, 판매, 대치품
UATM30M2C Datasheet
CENTELLAX
Chip size: 2390x920um (94.1x36.2mil)
Chip size tolerance: ±5um (0.2mil)
Chip thickness: 100 ±10um (4 ±0.4mil)
Pad dimensions: 80x80um (3.1x3.1mil)
Die size, pad locations, and pad descriptions
Applications Support
Alternate assembly diagrams and other additional
application support are available upon request.
Visit the Centellax website for large printable
assembly diagrams and application notes:
http://www.centellax.com/products/microwave/mmi
cs/UATM30M2C.shtml.
Pick-up and Chip Handling:
This MMIC has exposed air bridges on the top sur-
face. Do not pick up chip with vacuum on the
die center; handle from edges or with a custom
collet.
2 - 30GHz bonding diagram
Thermal Heat Sinking:
To avoid damage and for optimum performance,
you must observe the maximum channel tempera-
ture and ensure adequate heat sinking.
ESD Handling and Bonding:
This MMIC is ESD sensitive; preventive meas-
ures should be taken during handling, die attach,
and bonding.
Epoxy die attach is recommended. Please visit
our website for more handling, die attach and bond-
ing information: http://www.centellax.com/.
Recommended Components
>20pF DC Block:
Presidio SL1010X7R101M16VH
>120pF DC Block:
Presidio SL1010X7R181M16VH
Drain Bias Inductor:
Piconics CC21T36K240G5
Bypass Capacitors:
Drain: Presidio SL5050X7R222M16VH
Gate: Presidio SL3535X7R182M16VH
40MHz - 30GHz bonding diagram
CENTELLAX • Web: http://www.centellax.com/ • Email: [email protected] • Tel: 866.522.6888 • Fax: 707.568.7647
Specifications subject to change without notice. Copyright © 2001-2004 Centellax, Inc. Printed in USA. 10 Aug 2004.

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부품번호상세설명 및 기능제조사
UATM30M2C

0.04-30GHz Broadband MMIC Low Noise Amplifier

Centellax
Centellax

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