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DG419 데이터시트 PDF




Analog Devices에서 제조한 전자 부품 DG419은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 DG419 기능
기능 LC2MOS Precision Mini-DIP Analog Switch
제조업체 Analog Devices
로고 Analog Devices 로고


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DG419 데이터시트, 핀배열, 회로
a
FEATURES
44 V Supply Maximum Ratings
VSS to VDD Analog Signal Range
Low On Resistance (<35 )
Ultralow Power Dissipation (<35 W)
Fast Switching Times
tON (160 ns max)
tOFF (100 ns max)
Break-Before-Make Switching Action
Plug-In Replacement for DG417
APPLICATIONS
Precision Test Equipment
Precision Instrumentation
Battery Powered Systems
Sample Hold Systems
LC2MOS Precision
Mini-DIP Analog Switch
ADG417
FUNCTIONAL BLOCK DIAGRAM
SD
ADG417
IN
SWITCH SHOWN FOR A
LOGIC "1" INPUT
GENERAL DESCRIPTION
The ADG417 is a monolithic CMOS SPST switch. This switch
is designed on an enhanced LC2MOS process that provides low
power dissipation yet gives high switching speed, low on resis-
tance and low leakage currents.
The on resistance profile of the ADG417 is very flat over the
full analog input range ensuring excellent linearity and low
distortion. The part also exhibits high switching speed and high
signal bandwidth. CMOS construction ensures ultralow power
dissipation making the parts ideally suited for portable and
battery powered instruments.
The ADG417 switch, which is turned ON with a logic low on
the control input, conducts equally well in both directions when
ON and has an input signal range that extends to the supplies.
In the OFF condition, signal levels up to the supplies are
blocked. The ADG417 exhibits break-before-make switching
action for use in multiplexer applications. Inherent in the design
is low charge injection for minimum transients when switching
the digital input.
PRODUCT HIGHLIGHTS
1. Extended Signal Range
The ADG417 is fabricated on an enhanced LC2MOS process,
giving an increased signal range that extends to the supply
rails.
2. Ultralow Power Dissipation
3. Low RON
4. Single Supply Operation
For applications where the analog signal is unipolar, the
ADG417 can be operated from a single rail power supply.
The part is fully specified with a single +12 V power supply
and will remain functional with single supplies as low as
+5 V.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700 World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 1998




DG419 pdf, 반도체, 판매, 대치품
ADG417
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Analog, Digital Inputs2 . . . . . . . . . . . . . VSS – 2 V to VDD +2 V
or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 400 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 100°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 400 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec). . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG417 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
TERMINOLOGY
VDD Most positive power supply potential.
VSS Most negative power supply potential in dual
supplies. In single supply applications, it
may be connected to GND.
VL
GND
Logic power supply (+5 V).
Ground (0 V) reference.
S Source terminal. May be an input or an
output.
D Drain terminal. May be an input or an
output.
IN Logic control input.
RON
IS (OFF)
Ohmic resistance between D and S.
Source leakage current with the switch
“OFF.”
ID (OFF)
Drain leakage current with the switch
“OFF.”
ID, IS (ON)
Channel leakage current with the switch
“ON.”
VD (VS)
CS (OFF)
CD (OFF)
CD, CS (ON)
tON
tOFF
VINL
VINH
IINL (IINH)
Charge Injection
Off Isolation
IDD
ISS
IL
Analog voltage on terminals D, S.
“OFF” switch source capacitance.
“OFF” switch drain capacitance.
“ON” switch capacitance.
Delay between applying the digital control
input and the output switching on.
Delay between applying the digital control
input and the output switching off.
Maximum input voltage for logic “0.”
Minimum input voltage for logic “1.”
Input current of the digital input.
A measure of the glitch impulse transferred
from the digital input to the analog output
during switching.
A measure of unwanted signal coupling
through an “OFF” channel.
Positive supply current.
Negative supply current.
Logic supply current.
–4– REV. A

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DG419 전자부품, 판매, 대치품
Test Circuits
IDS
V1
SD
VS
RON = V1/IDS
Test Circuit 1. On Resistance
IS (OFF)
VS
SD
ID (OFF)
VD
Test Circuit 2. Off Leakage
ADG417
SD
VS
ID (ON)
VD
Test Circuit 3. On Leakage
REV. A
VDD
0.1F
VL
0.1F
3V
VDD
VL
VIN
S2
VS
IN
D
VOUT
RL
300
CL
35pF
VOUT
GND VSS
0.1F
50%
50%
90%
tON
90%
tOFF
VSS
Test Circuit 4. Switching Times
VDD
0.1F
VL
0.1F
VDD
VL
RL S2
D
VS
IN
GND VSS
VOUT
CL
10nF
3V
VIN
VOUT
VOUT
QINJ = CL ؋ ⌬VOUT
0.1F
VSS
Test Circuit 5. Charge Injection
VDD
0.1F
VL
0.1F
VDD
S
VL
D
IN
VOUT
RL
50
VS GND VSS
VIN
0.1F
VSS
Test Circuit 6. Off Isolation
–7–

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