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PDF SPI-238-18 Data sheet ( Hoja de datos )
| Número de pieza | SPI-238-18 | |
| Descripción | Ultraminiature photointerrupter (single-transistor type) | |
| Fabricantes | Sanyo Semicon Device | |
| Logotipo |  |
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Ordering number : EN6026
SPI-238-18
GaAs Infrared LED
SPI-238-18
Ultraminiature photointerrupter
(single-transistor type)
Features
• GaAs Infrared LED plus Single Phototransistor
• Photo-Interrupter
• Contact type
• Compact type : H4.95 ! L6.0 ! W5.5mm
Absolute Maximum Ratings at Ta=25°C, 65%RH
Parameter
Symbol
Forward Current
IF
Input LED
Reverse Voltage
Power Dissipation
VR
PD
Output
Phototransistor
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Curren
VCEO
VECO
IC
Power Dissipation
PC
Operating Temperature
Topr
Storage Temperature
Tstg
Soldering Temperature *1
Tsol
*1 Soldering conditions : time : max. 3sec; clearance : min. 1mm from lower stay
Rating
50
5
70
20
5
20
70
--20 to +80
--30 to +85
260
Unit
mA
V
mW
V
V
mA
mW
°C
°C
°C
Electro-Optical Characteristics at Ta=25°C, 65%RH
Parameter
Symbol
Input
Output
Coupled
Forward Voltage
Reverse Current
Dark Current
Collector Output Current
Collector Emitter
Saturation Voltage
VF
IR
ICEO
IC
VCE(sat)
Rise Time
tr
Fall Time
tf
*1 Measurement Circuit of Collector Current
Condition
IF=10mA
VR=5V
IF=0mA, VCE=10V
IF=10mA,VCE=5V*1
IF=10mA, IC=20µA
VCC=5V, RL=100Ω
IC=1mA
IF=10mA
Ic
Min.
1.0
--
--
40
--
--
--
Typ.
1.15
--
10
200
--
10
10
VCE=5V
A
Max.
1.4
10
200
400
0.5
--
--
Unit
V
µA
nA
µA
V
µs
µs
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, (MI) No.6026 1/6
1 page  
SPI-238-18
Package dimensions and Pin connection
As stated in the sttached paper. (No.6026 4/6)
Soldering conditions
(1) Temperature : Max. 260°C
(2) Time
: Max. 3 sec
(3) Clearance : Min. 1mm from stay (include PCB thickness)
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend under the stay.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the recommended mounting dimension.
(3) Two stays coupling LED and Ph. Tr should be isolated from any PCB pattern or any lead.
(4) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(5) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(6) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
No.6026 5/6
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SPI-238-18.PDF ] | |
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