|
|
PDF SPI-336-99-T1 Data sheet ( Hoja de datos )
| Número de pieza | SPI-336-99-T1 | |
| Descripción | Ultraminiature photoreflector supporting reflow soldering Single transistor type | |
| Fabricantes | Sanyo Semicon Device | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de SPI-336-99-T1 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
|
No Preview Available !
Ordering number : EN6030
SPI-336-99-T1
Infrared LED
SPI-336-99-T1
Ultraminiature photoreflector supporting reflow soldering
(Single transistor type)
Features
• Infrared LED plus Phototransistor (single)
• DIP type
• Compact type : 3.4 (L) ! 2.7 (W) ! 1.5 (H) mm
• Visible light cut type
• Taping type
Absolute Maximum Ratings at Ta=25°C, 65%RH (as per JIS C7032)
Input LED
Output
Phototransistor
Parameter
Forward Current
Reverse Voltage
Power Dissipation
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Curren
Power Dissipation
Operating Temperature
Storage Temperature
Symbol
IF
VR
PD
VCEO
VECO
IC
PC
Topr
Tstg
Rating
50
5
70
20
5
20
70
--20 to +80
--30 to +100
Unit
mA
V
mW
V
V
mA
mW
°C
°C
Electro-Optical Characteristics at Ta=25°C, 65%RH
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Input
Forward Voltage
Reverse Current
VF
IR
Output Dark Current
ICEO
Collector Output
IC
Leakage Current
ILEAK
Coupled Collector Emitter
Rise Time
VCE(sat)
tr
Fall Time
tf
*1 Location of reflector is shown in Fig. 1.
IF=10mA
VR=5V
IF=0mA, VCE=10V
IF=10mA,VCE=5V *1
IF=10mA,VCE=5V *2
IF=10mA, IC=50µA
VCC=5V, RL=100Ω
IC=1mA
1.0
--
--
80
--
--
--
--
1.2 1.6
V
-- 10 µA
-- 200 nA
--
1100
µA
-- 1 µA
-- 0.5 V
5 -- µs
5 -- µs
*2 No reflector
*3 Table of Classification of Collector Output
Class
A
B
C
Ic (µA) 1100 to 450 600 to 260 350 to 150
D
200 to 80
AL V.E. film
Glass plate (t=1mm)
Fig. 1 Location of Reflector
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, (MI) No.6030 1/6
1 page  
SPI-336-99-T1
Package dimensions and Pin connection
As stated in the sttached paper. (No.6030 4/6)
Soldering conditions
(1) Reflow soldering
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only two time.
Temperature : On the topsurface of product
Reflow type : Hot air
Max 240°C
200°C
Max 165°C
Max 120sec
(2) Manusl soldering
Temperature
Time
Clearance
: Max. 290°C (Soldering iron tip temperature)
: Max. 3 sec
: Min. 0.5mm from package
Max 10sec
Max 60sec
0.5mm
0.5mm
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 0.5mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
q The product after the open dry packing should be stored in the dry packing again.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature
: 5 to 30°C
Humidity
: Max 70%RH
Term
: Max 7days
w The product to be out the term without dry packing must be practiced baking.
Baking conditions : +60±5°C, 10 to 20Hr
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
No.6030 5/6
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SPI-336-99-T1.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| SPI-336-99-T1 | Ultraminiature photoreflector supporting reflow soldering Single transistor type | Sanyo Semicon Device |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |