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PDF ARM926EJ-S Data sheet ( Hoja de datos )
| Número de pieza | ARM926EJ-S | |
| Descripción | 0.11 um Processor | |
| Fabricantes | LSI Logic | |
| Logotipo |  |
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DATASHEET
0.11 µm Processor
System for
ARM926EJ-S™
cw001200_agflxr_2_0
February 2005
Preliminary
®
DB08-000261-01
1 page  
www.DataSheet4U.com
Contents
Chapter 1
Introduction
1.1 RapidChip Technology Overview
1-1
1.1.1 RapidChip Platform ASICs
1-1
1.1.2 CoreWare IP Program
1-2
1.1.3 RapidReady™ Certification
1-2
1.1.4 RapidWorx
1-2
1.2 Processor System for ARM926EJ-S Product Description
1-3
1.2.1 Processor System for ARM926EJ-S Overview
1-3
1.2.2 Processor System for ARM926EJ-S Features and
Benefits
1-4
1.2.3 Processor System for ARM926EJ-S Options
1-5
1.2.4 Processor System for ARM926EJ-S Deliverables 1-6
1.3 Required Platform ASIC Resources
1-6
1.4 Required Cores
1-7
Chapter 2
Architectural Description
2.1 Processor System for ARM926EJ-S Block Diagram
2.2 ARM926EJ-S Processor Block Description
2.3 Instruction AHB Bus Block Description
2.4 Data AHB Bus Block Description
2.5 APB Bus Block Description
2.6 Interrupts
2-1
2-2
2-3
2-3
2-4
2-5
Chapter 3
Registers
3.1 Register Summary
3.1.1 External SRAM Registers
3-1
3-1
0.11 µm Processor System for ARM926EJ-S Datasheet
Copyright © 2004, 2005 by LSI Logic Corporation. All rights reserved.
v
5 Page 
www.DataSheet4U.com
Chapter 1
Introduction
The 0.11 µm Processor System for ARM926EJ-S™ is compatible with
the RapidWorx® design tools and design methodology and ready to
integrate into the RapidChip® Platform ASIC families.
This chapter contains the following sections:
• Section 1.1, “RapidChip Technology Overview”
• Section 1.2, “Processor System for ARM926EJ-S Product
Description”
1.1 RapidChip Technology Overview
RapidChip Platform ASICs, RapidWorx design methodology, and
RapidWorx design tools are all based on RapidChip Technology. This
section briefly explains these concepts. For more information about
RapidChip Technology, go to http://www.rapidchip.com.
1.1.1 RapidChip Platform ASICs
RapidChip Technology allows you to customize the metal layers of a
partially manufactured semiconductor wafer that contains multiple copies
of a predefined platform ASIC. The silicon layers of a platform ASIC have
diffused IP resources that are later connected with user-specific
metallization patterns.
Because platform ASICs are available as partially manufactured devices,
customers benefit from dramatically reduced lead times for prototypes
and production units as well as lower inventory costs. The broad range
of resources available in platform ASICs meets the needs of many
different systems and applications.
0.11 µm Processor System for ARM926EJ-S Datasheet
Copyright © 2004, 2005 by LSI Logic Corporation. All rights reserved.
1-1
11 Page | ||
| Páginas | Total 70 Páginas | |
| PDF Descargar | [ Datasheet ARM926EJ-S.PDF ] | |
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