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BGW200 데이터시트 PDF




Philips에서 제조한 전자 부품 BGW200은 전자 산업 및 응용 분야에서
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PDF 형식의 BGW200 자료 제공

부품번호 BGW200 기능
기능 Low Power WLAN SiP
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BGW200 데이터시트, 핀배열, 회로
BGW200 Low-power
WLAN SiP
Complete, single-package 802.11b
solution for mobile handheld devices
Optimized for low-power mobile applications, this complete,
single-package 802.11b solution combines a baseband/MAC,
RF transceiver, and power amplifier into an ultra-small
(150 mm2) package. It delivers the industry’s lowest power
consumption in standby mode and supports coexistence with
Bluetooth® solutions.
Semiconductors
The BGW200 is a complete, low-power 802.11b Wireless LAN (WLAN)
System-in-a-Package (SiP) solution optimized for battery-powered hand-
held devices. It enables consumers to connect to the growing number of
WLAN networks in offices, homes, and public places. It also allows service
providers to increase their network reach and customer base, enabling
complementary data and voice services across cellular/PCS and WLAN
networks. Coexistence support for Bluetooth 1.1 and 1.2 enables seamless
integration with Philips Bluetooth solutions.
Key features
Advanced, single-package WLAN SiP optimized for mobile handheld
devices
No RF-critical design required
Low total cost of ownership
Lowest power consumption in standby mode: < 2 mW (typ)
Ultra-small form factor
Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
Only three external components for entire solution
“No Host Load” design delivers easy integration and longer battery life
Host processor sleeps while BGW200 processes beacons
BGW200 wakes the host processor only upon data packet arrival
Co-exists with Bluetooth 1.1 and 1.2
Complete software drivers, utility, and diagnostic tools
Applications
Smartphones, cellular phones,VoIP wireless phones
PDAs, handheld computing devices,WLAN adapter cards (Secure Digital)
Portable audio/video devices, MP3 players
Other handhelds and electronic devices for wireless digital, audio, multi-
media, and telephony
The SiP format, with its complete system functionality, delivers quicker
design cycles, lower risk, simplified manufacturing, and a reduced bill of
materials.The single-package format also simplifies assembly and testing,
and reduces yield losses.The SiP delivers a complete, fully tested imple-
mentation of 802.11b functionality, so development teams can focus their
energy on innovative product design instead of solving complex issues
related to RF layout.
Ultra-small footprint, ultra-low power consumption
The BGW200 uses a single, 68-pin HVQFN-like package that measures
only 10 x 15 x 1.3 mm.The entire 802.11b solution requires only three
external components and uses less than 180 mm2 of circuit board area.
The BGW200 incorporates several features that decreases power con-
sumption.There is an integrated ARM7 processor, 1.25 Mbytes of SRAM,
256 Kbytes of ROM, optimized host interfaces (SDIO/SPI), and integrated
power management hardware/software algorithms.The result is the lowest
standby power consumption in the industry (less than 2 mW).
Superior “No Host Load” Architecture
The BGW200 is designed to place no load on the host processor, so
mobile devices can integrate WLAN functionality without compromis-
ing application performance or battery life.The BGW200 only interfaces




BGW200 pdf, 반도체, 판매, 대치품
BGW200
Low-power 802.11b SiP with baseband/MAC and RF transceiver for mobile handhelds
w w w. se m i co n d u c t o r s . p h i l i p s .co m
Philips Semiconductors
Philips Semiconductors is a worldwide company with over 100 sales offices
in more than 50 countries. For a complete up-to-date list of our sales of-
fices please e-mail [email protected]. A
complete list will be sent to you automatically.You can also visit our website
http://www.semiconductors.philips.com/sales.
© Koninklijke Philips Electronics N.V. 2004
SCL 76
All rights reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document
does not form part of any quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent or other industrial or intellectual property rights.
Published in USA
Date of release: May 2004
document order number: 9397-750-13342

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부품번호상세설명 및 기능제조사
BGW200

Low Power WLAN SiP

Philips
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