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PDF MC33186 Data sheet ( Hoja de datos )
| Número de pieza | MC33186 | |
| Descripción | Automotive H-Bridge Driver | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MC33186 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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Rev: 3.3 Date: 13 Dec 2000
Freescale Semiconductor, Inc.
Automotive H-Bridge Driver
MC33186
• Operating Supply Voltage 5V to 28V
• Overvoltage Protection against Transients up to 40V at Vbat
• RDSon = 150mΩ for each Output Transistor at 25°C
• Continous DC Load Current 5A (TC < 100°C)
• Output Current Limitation at typ 6,5A +/- 20%
• Short-Circuit Shutdown for Output Currents over 8A
• Logic Inputs TTL/CMOS Compatible
• Operating Frequency up to 20 kHz
• Overtemperature Protection
• Short-Circuit Protection
• Undervoltage Disable Function
• Diagnostic Output
• 2 Disable Inputs
• Coding Input for Alternative Functions
• HSOP20 Power Package
• Stable Operation with an External Capacitance of maximum 47µF at Vbat
H-BRIDGE DRIVER
SEMICONDUCTOR
TECHNICAL DATA
DH1 SUFFIX
PLASTIC PACKAGE
CASE 751A-03
HSOP-20
PIN CONNECTIONS
Cp
Charge-Pump
Simplified Block Diagram
Vbat Vbat
Internal 5V
Vbat
SF
IN1
IN2
DI1
DI2
COD
Under-Voltage
Gate Control: 1-2
Logic
Gate Control: 3-4
Over temperature
Current limitation
Overcurrent
High-Side
Overcurrent
Low-Side
OUT1
OUT2
AGND 1
20 NC
SF 2
19 IN2
IN1 3
18 DI1
Vbat 4
Vbat 5
OUT1 6
17 CP
1 6 Vbat
15 OUT2
OUT1 7
14 OUT2
COD 8
13 DI2
PGND 9
12 PGND
PGND 10
11 PGND
Metal slug is connected to power ground
(Top View)
GROUND
ORDERING INFORMATION
Device
MC33186DH1R2
Temperature
Range
-40°C to +125°C
Package
HSOP20
For More Information On This Product,
Go to: www.freescale.com
1 page  
MC33186
FreescPIaNSleFUNSCeTImONiDcEoSCnRdIPuTIOcNtor, Inc.
Pin
9, 10, 11, 12
Metal slug
Name
GND
Power Ground
Description
1
GND
Analog ground
2 Output Status- Open drain output, active low.
flag (SF)
Is set according to the truth table .
3,13
18, 19
Inputs IN1,IN2 Voltage controlled inputs with hysteresis
DI1,DI2, COD
8
COD
When not connected or connected to GND, a stored failure will be reset by change of
the voltage-level on DI1 or DI2.
When connected to Vcc, the disable pin DI1 and DI2 are inactive. A stored failure will
be reset by change of the voltage-level on IN1 or IN2 .
6, 7, 14, 15 OUT1 , OUT2 H-Bridge outputs with integrated free-wheeling diodes.
4, 5, 16
Vbat
The pins 4 and 5 are internally connected. These pins supply the left high side and the
analogue/logic part of the device.
The pin 16 supplies the right high side and the charge pump.
The pins 4, 5 and 16 should be connected together on the printed circuit board with
connections as short as possible.
Supervision and protection functions
a) Supply voltage supervision
The supply voltage is supervised . If it is below its specific threshold , the power stages
are switched in tristate and the status flag is switched low.
If the supply voltage is over the specific theshold again , the power stage switches inde-
pendently into normal operation, according to the input pins and the status flag is reset .
b) Thermal supervision
In case of over-temperature the power stages are switched in tristate independent of
the inputs signals and the status flag is switched low.
If the level changes from high to low on DI1 (IN1) or low to high on DI2 ( IN2 ), the out-
put stage switches on again if the temperature is below the specified limit .The status-
flag is reset to high level (Pinnames in brackets refer to coding pin=Vcc).
c) Supervision of overcurrent
If overcurrent is detected the power stages are independent of the inputs signals
switched in tristate and the status flag is set .
If the level changes from high to low on DI1 ( IN1 ) or low to high on DI2 ( IN2 ) the out-
put stage switches on again and the status flag is reset to high level (Pinnames in
brackets refer to coding pin = Vcc).
The output stage switches into the mode defined by the inputs pins provided the tem-
perature is below the specified limits .
d) Current limiting
The maximum current which can flow under normal operating conditions is limited to
Imax = 6,5A +/- 20% .When the maximum current value is reached, the output stages
are switched tristate for a fixed time. According to the time constant the current
decreases until the next switch on occurs. See page 8 for schematics.
MC33186
For More InfoMrOmTaOtiRoOnLOAn This Product,
Go to: www.freescale.com
5
5 Page 
MC33186
FreescalPeACSKAeGmE INiFcOoRnMAdTuIOcN tor, Inc.
The HSOP20 package is designed for enhanced thermal
performance. The particularity of this package is its copper
baseplate on which the power die is soldered. The baseplate
is soldered on a PCB to provide heat flow to the ambient and
also to provide a large thermal capacitance.
Of course, the more copper area on the PCB, the better
the power dissipation and transient behaviour.
We characterized the HSOP20 on a double side PCB. The
bottom side area of the copper is 7.8 cm2. The top surface is
2.7 cm2, see Figure 22.
Figure 22. PCB Test Layout
Figure 23. PHSOP20 Thermal Response
100
10
Rth (°C/W)
1
0,1
0,001
0,01
0,1
1 10
t, Time (s)
100
1000
10000
Figure 23 shows the thermal response with the device
soldered on to the test PCB described on figure 22.
Top Side
Bottom Side
MC33186
For More Information On This Product,
Go to: MwOwTwOR.fOreLeAscale.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MC33186.PDF ] | |
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