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PDF MC33274A Data sheet ( Hoja de datos )
| Número de pieza | MC33274A | |
| Descripción | HIGH PERFORMANCE OPERATIONAL AMPLIFIERS | |
| Fabricantes | Motorola Semiconductors | |
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Order this document by MC33272A/D
MC33272A
MC33274A
Single Supply, High Slew Rate
Low Input Offset Voltage,
Bipolar Operational Amplifiers
The MC33272/74 series of monolithic operational amplifiers are quality
fabricated with innovative Bipolar design concepts. This dual and quad
operational amplifier series incorporates Bipolar inputs along with a patented
Zip–R–Trim element for input offset voltage reduction. The MC33272/74
series of operational amplifiers exhibits low input offset voltage and high gain
bandwidth product. Dual–doublet frequency compensation is used to
increase the slew rate while maintaining low input noise characteristics. Its
all NPN output stage exhibits no deadband crossover distortion, large output
voltage swing, and an excellent phase and gain margin. It also provides a
low open loop high frequency output impedance with symmetrical source
and sink AC frequency performance.
The MC33272/74 series is specified over –40° to +85°C and are available
in plastic DIP and SOIC surface mount packages.
• Input Offset Voltage Trimmed to 100 µV (Typ)
• Low Input Bias Current: 300 nA
• Low Input Offset Current: 3.0 nA
• High Input Resistance: 16 MΩ
• Low Noise: 18 nV/ √ Hz @ 1.0 kHz
• High Gain Bandwidth Product: 24 MHz @ 100 kHz
• High Slew Rate: 10 V/µs
• Power Bandwidth: 160 kHz
• Excellent Frequency Stability
• Unity Gain Stable: w/Capacitance Loads to 500 pF
• Large Output Voltage Swing: +14.1 V/ –14.6 V
• Low Total Harmonic Distortion: 0.003%
• Power Supply Drain Current: 2.15 mA per Amplifier
• Single or Split Supply Operation: +3.0 V to +36 V or ±1.5 V to ±18 V
• ESD Diodes Provide Added Protection to the Inputs
Op Amp
Function
Dual
Quad
ORDERING INFORMATION
Device
Operating
Temperature Range
MC33272AD
MC33272AP
MC33274AD
TA = –40° to +85°C
MC33274AP
Package
SO–8
Plastic DIP
SO–14
Plastic DIP
HIGH PERFORMANCE
OPERATIONAL
AMPLIFIERS
SEMICONDUCTOR
TECHNICAL DATA
DUAL
8
1
P SUFFIX
PLASTIC PACKAGE
CASE 626
8
1
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
PIN CONNECTIONS
Output 1 1
Inputs 1
2–
+
3
VEE 4
8 VCC
7 Output 2
–6
+
Inputs 2
5
(Top View)
QUAD
14
1
P SUFFIX
PLASTIC PACKAGE
CASE 646
14
1
D SUFFIX
PLASTIC PACKAGE
CASE 751A
(SO–14)
PIN CONNECTIONS
Output 1 1
2
Inputs 1
–
3 +1
VCC 4
5
Inputs 2
6
+
–2
Output 2 7
14 Output 4
13
–
4 + 12
Inputs 4
11 VEE
+ 10
3– 9
Inputs 3
8 Output 3
(Top View)
MOTOROLA ANALOG IC DEVICE DATA
© Motorola, Inc. 1996
Rev 0
1
1 page  
MC33272A MC33274A
Figure 8. Split Supply Output Voltage Swing
versus Supply Voltage
40
TA = 25°C
30
RL = 10 kΩ
20 RL = 2.0 kΩ
10
0
0 5.0 10 15 20
VCC, VEE SUPPLY VOLTAGE (V)
VCC
VCC –1.0
VCC –2.0
Figure 9. Split Supply Output Saturation
Voltage versus Load Current
Source
TA = 125°C
TA = –55°C
TA = 25°C
VEE +2.0 Sink TA = 25°C
VEE +1.0 TA = 125°C
VEE
0
5.0 10
TA = –55°C
VCC = +5.0 V to +18 V
VEE = –5.0 V to –18 V
15 20
IL, LOAD CURRENT (±mA)
VCC
VCC –4.0
VCC –8.0
Figure 10. Single Supply Output Saturation
Voltage versus Load Resistance to Ground
TA = 125°C
TA = 55°C
VCC
VCC = +5.0 V to +18 V
RL to Gnd
VEE = Gnd
VCC –12
+0.2
+0.1
Gnd
0
100
TA = 125°C
TA = +25°C
TA = –55°C
1.0 k 10 k 100 k
RL , LOAD RESISTANCE TO GROUND (kΩ)
1.0 M
Figure 11. Single Supply Output Saturation
Voltage versus Load Resistance to VCC
15
14.6 TA = 125°C
14.2 TA = 25°C
TA = 55°C
8.0
4.0
0
10
TA = 25°C
TA = –55°C
TA = 125°C
VCC = +15 V
RL to VCC
VEE = Gnd
RFdbk = 100 kΩ
100 1.0 k 10 k
RL, LOAD RESISTANCE TO VCC (Ω)
100 k
Figure 12. Output Voltage versus Frequency
28
24
20
16
12 VCC = +15 V
VEE = –15 V
8 RL = 2.0 kΩ
AV = +1.0
4
THD = ≤1.0%
TA = 25°C
0
1.0 k 10 k
100 k
f, FREQUENCY (Hz)
1.0 M
1 0M
Figure 13. Common Mode Rejection
versus Frequency
120
100
TA = 125°C
80
TA = –55°C
VCC = +15 V
VEE = –15 V
VCM = 0 V
∆VCM = ±1.5 V
60
40 ∆VCM
–
ADM
+
∆VO
20 CMR = 20Log
0
10 100
∆VCM
∆VO X ADM
1.0 k 10 k
f, FREQUENCY (Hz)
100 k
1.0 M
MOTOROLA ANALOG IC DEVICE DATA
5
5 Page 
14
1
A
F
HG
MC33272A MC33274A
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 646–06
ISSUE L
8
B
7
C
N
SEATING
PLANE
D
K
L
J
M
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
G 0.100 BSC
2.54 BSC
H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC
7.62 BSC
M 0_ 10_ 0_ 10_
N 0.015 0.039 0.39 1.01
–A–
14
1
G
D SUFFIX
PLASTIC PACKAGE
CASE 751A–03
(SO–14)
ISSUE F
8
–B–
7
P 7 PL
0.25 (0.010) M B M
C R X 45 _
–T–
SEATING
PLANE
D 14 PL
K
0.25 (0.010) M T B S A S
M
F
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
MOTOROLA ANALOG IC DEVICE DATA
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MC33274A.PDF ] | |
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