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PDF TC1269 Data sheet ( Hoja de datos )
| Número de pieza | TC1269 | |
| Descripción | 300mA CMOS LDO with Shutdown and VREF Bypass | |
| Fabricantes | Microchip Technology | |
| Logotipo |  |
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TC1269
300mA CMOS LDO with Shutdown and VREF Bypass
Features
• Very Low Ground Current for Longer Battery Life
• Very Low Dropout Voltage
• 300mA Output Circuit
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Power Saving Shutdown Mode
• Bypass Input for Ultra Quiet Operation
• Over Current and Over Temperature Protection
• Space-Saving MSOP Package
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulator for SMPS
• Pagers
• Digital Cameras
Device Selection Table
Output*
Part Number Voltage Package
(V)
Junction
Temp. Range
TC1269-2.5VUA 2.5 8-Pin MSOP -40°C to +125°C
TC1269-2.8VUA 2.8 8-Pin MSOP -40°C to +125°C
TC1269-3.0VUA 3.0 8-Pin MSOP -40°C to +125°C
TC1269-3.3VUA 3.3 8-Pin MSOP -40°C to +125°C
TC1269-5.0VUA 5.0 8-Pin MSOP -40°C to +125°C
*Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
8-Pin MSOP
VOUT 1
8 VIN
NC 2 TC1269 7 SHDN
NC 3
6 NC
GND 4
5 Bypass
General Description
The TC1269 is a fixed output, high accuracy (typically
±0.5%) CMOS upgrade for older (bipolar) low dropout
regulators. Total supply current is typically 50µA at full
load (20 to 60 times lower than in bipolar regulators).
TC1269 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load), and fast response to step
changes in load. Supply current is reduced to 0.05µA
(typical) and VOUT falls to zero when the shutdown
input is low.
The TC1269 incorporates both over temperature and
over current protection. The TC1269 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA.
Typical Application
VOUT
1
+ C1 VOUT
8
VIN
VIN
1µF
2 NC
7
SHDN
Shutdown Control
TC1269
(from Power
Control Logic)
3 NC
6
NC
4 GND Bypass
CBYPASS
470pF
(Optional)
© 2002 Microchip Technology Inc.
DS21380B-page 1
1 page  
4.0 THERMAL CONSIDERATIONS
4.1 Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
Where:
PD = Worst case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
The maximum allowable power dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (θJA).
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX)
θJA
Where all terms are previously defined.
TC1269
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
VOUTMIN
ILOAD
TAMAX
= 3.0V ± 10%
= 2.7V – 2.5%
= 250mA
= 55°C
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN) ILOADMAX
= [(3.0 x 1.1) – (2.7 x .975)]250 x 10-3
= 167mW
Maximum allowable power dissipation:
PDMAX = (TJMAX – TAMAX)
θJA
= (125 – 55)
200
= 350mW
In this example, the TC1269 dissipates a maximum of
167mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
4.3 Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θJA and, therefore,
increase the maximum allowable power dissipation
limit.
© 2002 Microchip Technology Inc.
DS21380B-page 5
5 Page 
TC1269
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Tech-
nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
© 2002 Microchip Technology Inc.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21380B-page 11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TC1269.PDF ] | |
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