PDF MC33997 Data sheet ( Hoja de datos )

Número de pieza	MC33997
Descripción	Switching Power Supply with Linear Regulators
Fabricantes	Motorola Semiconductors
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No Preview Available ! Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR TECHNICAL DATA Document order number: MC33997/D Rev 3.0, 03/2003 Advance Information Switching Power Supply with Linear Regulators The 33997 is a medium-power, multi-output power supply integrated circuit that is capable of operating over a wide input voltage range, from 6.0 V up to 26.5 V with 40 V transient capability. It incorporates a sensorless current mode control step-down switching controller regulating directly to 5.0 V. The 3.3 V linear regulator uses an external pass transistor to reduce the 33997 power dissipation. The 33997 also provides a 3.3 V linear standby regulator and two 5.0 V sensor supply outputs protected by internal low-resistance LDMOS transistors. There are two separate enable pins for the main and sensor supply outputs and standard supervisory functions such as resets with power-up reset delay. The 33997 provides proper power supply sequencing for advanced microprocessor architectures such as the Motorola MPC5xx and 683xx microprocessor families. Features • Operating Voltage Range 6.0 V up to 26.5 V (40 V transient) • Step-Down Switching Regulator Output VDDH = 5.0 V @ 1400 mA (total) • Linear Regulator with External Pass Transistor VDDL = 3.3 V @ 400 mA • Low-Power Standby Linear Regulator VKAM = 3.3 V @ 10 mA • Two 5.0 V @ 200 mA (typical) Sensor Supplies VREF Protected Against Short-to-Battery and Short-to-Ground with Retry Capability • Undervoltage Shutdown on the VDDL, VDDH Outputs with Retry Capability • Reset Signals • Power-Up Delay • Enable Pins for Main Supplies (EN) and Sensor Supplies (SNSEN) • Power Sequencing for Advanced Microprocessor Architectures • SOIC-24WB Package 33997 POWER SUPPLY INTEGRATED CIRCUIT DW SUFFIX 24-LEAD SOICW CASE 751E ORDERING INFORMATION Device Temperature Range (TA) Package MC33997DW/R2 -40°C to 125°C 24 SOICW 33997 Simplified Application Diagram This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Motorola, Inc. 2003 For More Information On This Product, Go to: www.freescale.com 1 page Freescale Semiconductor, Inc. MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit Main Supply Voltage VPWR -0.3 to 45 V Keep-Alive Supply Voltage KA_VPWR -0.3 to 45 V Switching Node VSW -0.5 to 45 V 5.0 V Input Power VDDH -0.3 to 6.0 V Sensor Supply VREF1 VREF2 -0.3 to 18 -0.3 to 18 V Keep-Alive Supply Voltage VKAM -0.3 to 6.0 V Maximum Voltage at Logic I/O Pins EN SNSEN PWROK VKAMOK -0.3 to 6.0 -0.3 to 6.0 -0.3 to 6.0 -0.3 to 6.0 V Charge Pump Reservoir Capacitor Voltage CRES -0.3 to 18 V Error Amplifier Summing Node VSUM -0.3 to 6.0 V Switching Regulator Output Feedback FBKB -0.3 to 6.0 V VDDL Base Drive DRVL -0.3 to 6.0 V VDDL Feedback FBL -0.3 to 6.0 V ESD Voltage Human Body Model (all pins) (Note 1) Machine Model (all pins) (Note 2) VESD1 VESD2 ±500 ±100 V Power Dissipation (TA = 25°C) (Note 3) PD 800 mW Thermal Resistance, Junction to Ambient (Note 4), (Note 5) RθJ-A 60 °C/W Thermal Resistance, Junction to Board (Note 6) RθJ-B 20 °C/W Operational Package Temperature [Ambient Temperature] (Note 7) TA -40 to 125 °C Operational Junction Temperature TJ -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Lead Soldering Temperature (Note 8) TS 260 °C Notes 1. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω). 2. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω) 3. Maximum power dissipation at indicated junction temperature. 4. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 5. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 6. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 7. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking. 8. Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. MOTOROLA ANALOG INTEGRATED CIRFCoUIrTMDEoVrICeEIDnAfoTArmation On This Product, Go to: www.freescale.com 33997 5 5 Page Freescale Semiconductor, Inc. 6.0 0 5.0 2.5V 0 5.0 Timing Diagrams tSS 4.8V 0 TIME Figure 2. Soft-Start Time 14 0 5.0 0 tDet 5.0 4.0?V?V 2.0V 0 tRet 2.0V 3.3 0 TIME Figure 3. VREF Retry Timer 14 0 5.0 0 5.0 4.6V 0 tD(PWROK) 3.3 0 T IM E Figure 4. PWROK Delay Timer (Power-On Reset) MOTOROLA ANALOG INTEGRATED CIRFCoUIrTMDEoVrICeEIDnAfoTArmation On This Product, Go to: www.freescale.com 33997 11 11 Page

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