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PDF NUP1105L Data sheet ( Hoja de datos )
| Número de pieza | NUP1105L | |
| Descripción | Single Line CAN/LIN Bus Protector | |
| Fabricantes | ON Semiconductor | |
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NUP1105L
Advance Information
Single Line CAN/LIN
Bus Protector
The NUP1105L has been designed to protect LIN and single line
CAN transceivers from ESD and other harmful transient voltage
events. This device provides bidirectional protection for the data line
with a single SOT−23 package, giving the system designer a low cost
option for improving system reliability and meeting stringent EMI
requirements.
Features
• SOT−23 Package Allows One Separate Bidirectional Configuration
• 350 W Peak Power Dissipation per Line (8 x 20 msec Waveform)
• Low Reverse Leakage Current (< 100 nA)
• IEC Compatibility: − IEC 61000−4−2 (ESD): Level 4
− IEC 61000−4−4 (EFT): 40 A – 5/50 ns
− IEC 61000−4−5 (Lighting) 8.0 A (8/20 ms)
• ISO 7637−1, Nonrepetitive EMI Surge Pulse TBD
• ISO 7637−3, Repetitive Electrical Fast Transient (EFT) TBD
EMI Surge Pulses
• Flammability Rating UL 94 V−0
• Pb−Free Packages are Available
Applications
• Automotive Electronics
♦ LIN Bus
♦ Single Line CAN
• Industrial Control Networks
♦ Smart Distribution Systems (SDS™)
♦ DeviceNet™
http://onsemi.com
SOT−23 BIDIRECTIONAL
VOLTAGE SUPPRESSOR
350 W PEAK POWER
1
3
2
PIN 1. ANODE
2. ANODE
3. CATHODE
MARKING
DIAGRAM
SOT−23
CASE 318
STYLE 27
27D
M
27DM
1
= Device Code
= Date Code
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
ORDERING INFORMATION
Device
Package
Shipping†
NUP1105LT1
SOT−23 3000/Tape & Reel
NUP1105LT1G SOT−23 3000/Tape & Reel
(Pb−Free)
NUP1105LT3
NUP1105LT3G
SOT−23
SOT−23
(Pb−Free)
10000/Tape & Reel
10000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
September, 2004 − Rev. P0
1
Publication Order Number:
NUP1105L/D
1 page  
NUP1105L
PACKAGE DIMENSIONS
A
L
3
BS
12
VG
C
DH
SOT−23 (TO−236)
CASE 318−08
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
KJ
INCHES
DIM MIN
MAX
A 0.1102 0.1197
B 0.0472 0.0551
C 0.0350 0.0440
D 0.0150 0.0200
G 0.0701 0.0807
H 0.0005 0.0040
J 0.0034 0.0070
K 0.0140 0.0285
L 0.0350 0.0401
S 0.0830 0.1039
V 0.0177 0.0236
STYLE 27:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
MILLIMETERS
MIN MAX
2.80
3.04
1.20
1.40
0.89
1.11
0.37
0.50
1.78
2.04
0.013 0.100
0.085 0.177
0.35
0.69
0.89
1.02
2.10
2.64
0.45
0.60
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
0.8
0.031
2.0
0.079
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NUP1105L.PDF ] | |
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