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PDF CM1450 Data sheet ( Hoja de datos )
| Número de pieza | CM1450 | |
| Descripción | LCD & Camera EMI Filter Array with ESD Protection | |
| Fabricantes | California Micro Devices | |
| Logotipo |  |
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PRELIMINARY
CM1450
LCD & Camera EMI Filter Array with ESD Protection
Features
• Six and eight channels of EMI filtering
• Utilizes Praetorian™ inductor-based design tech-
nology for true L-C filter implementation
• OptiGuard™ coating for improved reliability
• ±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
• ±30kV ESD protection on each channel (HBM)
• Better than 40dB of attenuation at 1GHz
• Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
• 15-bump, 2.960mm x 1.330mm footprint
Chip Scale Package (CM1450-06CS/CP)
• 20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package (CM1450-08CS/CP)
• Lead-free version available
Applications
• LCD and Camera data lines in mobile handsets
• I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
• EMI filtering for data phones in cell phones, PDAs
or notebook computersWireless handsets / cell
phones
• Wireless Handsets
• Handheld PCs/PDAs
• LCD and camera modules
Product Description
The CM1450 comprises a family of inductor-capacitor
(L-C) based EMI filter arrays with integrated ESD pro-
tection in CSP form factor. The CM1450-06 and
CM1450-08 are configured in 6 and 8 channel formats
respectively. Each EMI filter channel of the CM1450 is
implemented as a 5-pole L-C filter where the compo-
nent values are 15pF-17nH-15pF-17nF-15pF. The
CM1450's roll-off frequency at -10dB attenuation is
300MHz and can be used in applications where the
data rates are as high as 120Mbps while providing
greater than 35dB over the 800MHz to 2.7GHz fre-
quency range. The parts integrate ESD protection
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports are
designed and characterized to safely dissipate ESD
strikes of ±15kV, beyond the Level 4 requirement of
the IEC61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than ±30kV.
This device is particularly well suited for portable elec-
tronics (e.g. wireless handsets, PDAs) because of its
small package format and easy-to-use pin assign-
ments. In particular, the CM1450 is ideal for EMI filter-
ing and protecting data and control lines for the LCD
display and camera interface in wireless handsets.
The CM1450 incorporates OptiGuard™ which results in
improved reliability at assembly. The CM1450 is avail-
able in a space saving, low profile Chip Scale Package
with optional lead-free finishing.
.
Electrical Schematic
FILTERn*
L1 L2
CC
C
FILTERn*
GND
(Pins B1-Bn)
1 of n EMI Filtering + ESD Channels
(n = 6 for CM1450-06, 8 for CM1450-08)
* See Package/Pinout Diagram
for expanded pin information.
© 2005 California Micro Devices Corp. All rights reserved.
01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com
1
1 page  
PRELIMINARY
CM1450
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
01/27/05 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet CM1450.PDF ] | |
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