PDF MURS320T3 Data sheet ( Hoja de datos )

Número de pieza	MURS320T3
Descripción	(MURS320T3 / MURS340T3 / MURS360T3) Surface Mount Ultrafast Power Rectifiers
Fabricantes	ON Semiconductor
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No Preview Available ! MURS320T3, MURS340T3, MURS360T3 Preferred Devices Surface Mount Ultrafast Power Rectifiers This series employs the state−of−the−art epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes, in surface mount applications where compact size and weight are critical to the system. Features • Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150°C) • Pb−Free Packages are Available Mechanical Characteristics • Case: Epoxy, Molded • Epoxy Meets UL 94 V−0 @ 0.125 in • Weight: 217 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped in 16 mm Tape and Reel, 2500 units per reel • Polarity: Notch in Plastic Body Indicates Cathode Lead • Device Meets MSL1 Requirements • ESD Ratings: Machine Model, C (> 400 V) Human Body Model, 3B (> 8000 V) © Semiconductor Components Industries, LLC, 2005 March, 2005 − Rev. 6 1 http://onsemi.com ULTRAFAST RECTIFIERS 3.0 AMPERES 200−600 VOLTS SMC CASE 403 PLASTIC MARKING DIAGRAM AYWW U3x U3 = Specific Device Code x = D, G, or J A = Assembly Location Y = Year WW= Work Week ORDERING INFORMATION Device MURS320T3 Package SMC Shipping† 2500/Tape & Reel MURS320T3G MURS340T3 SMC (Pb−Free) SMC 2500/Tape & Reel 2500/Tape & Reel MURS340T3G SMC 2500/Tape & Reel (Pb−Free) MURS360T3 SMC 2500/Tape & Reel MURS360T3G SMC 2500/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MURS320T3/D 1 page S A K MURS320T3, MURS340T3, MURS360T3 PACKAGE DIMENSIONS SMC PLASTIC PACKAGE CASE 403−03 ISSUE D DB PJ H C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03. INCHES DIM MIN MAX A 0.260 0.280 B 0.220 0.240 C 0.075 0.095 D 0.115 0.121 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.305 0.320 MILLIMETERS MIN MAX 6.60 7.11 5.59 6.10 1.90 2.41 2.92 3.07 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 7.75 8.13 SOLDERING FOOTPRINT* 4.343 0.171 3.810 0.150 2.794 0.110 ǒ ǓSCALE 4:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 5 Page

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