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PDF MC14584B Data sheet ( Hoja de datos )
| Número de pieza | MC14584B | |
| Descripción | Hex Schmitt Trigger | |
| Fabricantes | ON Semiconductor | |
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MC14584B
Hex Schmitt Trigger
The MC14584B Hex Schmitt Trigger is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. These devices find primary use where low power
dissipation and/or high noise immunity is desired. The MC14584B
may be used in place of the MC14069UB hex inverter for enhanced
noise immunity to “square up” slowly changing waveforms.
Features
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load over the Rated Temperature Range
• Double Diode Protection on All Inputs
• Can Be Used to Replace MC14069UB
• For Greater Hysteresis, Use MC14106B which is Pin−for−Pin
Replacement for CD40106B and MM74Cl4
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
MARKING
DIAGRAMS
14
SOIC−14
D SUFFIX
CASE 751A
14584BG
AWLYWW
1
TSSOP−14
DT SUFFIX
CASE 948G
14
14
584B
ALYWG
G
1
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Parameter
Value
Unit
VDD
Vin, Vout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
−0.5 to +18.0
−0.5 to VDD + 0.5
V
V
Iin, Iout
Input or Output Current
(DC or Transient) per Pin
± 10 mA
PD Power Dissipation, per Package
(Note 1)
500 mW
TA Ambient Temperature Range
−55 to +125
°C
Tstg Storage Temperature Range
−65 to +150
°C
TL Lead Temperature
(8−Second Soldering)
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
“D/DT” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
SOEIAJ−14
F SUFFIX
CASE 965
14
MC14584B
ALYWG
1
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
May, 2014 − Rev. 9
1
Publication Order Number:
MC14584B/D
1 page  
MC14584B
PACKAGE DIMENSIONS
14
H
1
0.25 M B M
D
e
SOIC−14 NB
CASE 751A−03
ISSUE K
A
B
8
E
7
13X b
0.25 M C A S
BS
A
A1
C
SEATING
PLANE
L
DETAIL A
h
X 45 _
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
A3 PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
DETAIL A
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 1.35 1.75 0.054 0.068
A1 0.10 0.25 0.004 0.010
A3 0.19 0.25 0.008 0.010
b 0.35 0.49 0.014 0.019
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
e 1.27 BSC
0.050 BSC
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
L 0.40 1.25 0.016 0.049
M 0_ 7_ 0_ 7_
SOLDERING FOOTPRINT*
6.50
1
14X
1.18
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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