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PDF MMZ2012xxxx Data sheet ( Hoja de datos )
| Número de pieza | MMZ2012xxxx | |
| Descripción | (MMZ Series) CHIP BEADFERRITE | |
| Fabricantes | TDK | |
| Logotipo |  |
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002-03 / 20040206 / e9412_mmz2012.fm
EMC Components
Ferrite Beads
SMD
MMZ Series MMZ2012 Type
Size: JIS/IEC 2012, EIA 0805
FEATURES
• Chip bead(impeder), MMZ series offers 4 construction materials.
• Size standardized for use by automatic assembly equipment. No
preferred orientation.
• Either flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• The products contain no lead and also support lead-free
soldering.
APPLICATIONS
PCs, CRTs, liquid crystal display panels, printers, hard disk drives,
game machines, cellular phones, etc.
PRODUCT IDENTIFICATION
MMZ 2012 R 121 A T
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
MATERIAL CHARACTERISTICS
R material: For wide frequency applications calling for broad
impedance characteristics.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (200 to 500MHz) for signal line applications.
TYPICAL MATERIAL CHARACTERISTICS
10000
1000
R
100
B
S
YD
10
11 10 100 1000
w Frequency(MHz)
ww.DataSheet4U.com• All specifications are subject to change without notice.
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| Número de pieza | Descripción | Fabricantes |
| MMZ2012xxxx | (MMZ Series) CHIP BEADFERRITE | TDK |
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