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부품번호 | MR18R1624AF0 기능 |
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기능 | (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die | ||
제조업체 | Samsung semiconductor | ||
로고 | |||
MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
Change History
Version 1.1 (August 2001)
* First copy.
* Based on the 1.0ver Rambus 256/288Mbit RIMM Module Datasheet
Version 1.2 (February 2002)
* Add 1066-35 binning
Version 1.3 (April 2002)
* Add 800-40 and 1066-32 binning
* Modify ∆TPD Value of AC electrical specifications
* Modify the Values of AC electrical specifications for RIMM Module
Version 1.4 (July 2002)
* Add 1066-32 512MB (16d RIMM Module) etc.
Page 0
Version 1.4 July 2002
MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
Table 3: Module Connector Pad Description
Signal
Gnd
LCFM
LCFMN
LCMD
LCOL4..
LCOL0
LCTM
LCTMN
LDQA8..
LDQA0
LDQB8..
LDQB0
LROW2..
LROW0
LSCK
NC
RCFM
RCFMN
RCMD
Pins
A1, A3, A5, A7, A9, A11, A13, A15,
A17, A19, A21, A23, A25, A27, A29,
A31, A33, A39, A52, A60, A62, A64,
A66, A68, A70, A72, A74, A76, A78,
A80, A82, A84, A86, A88, A90, A92,
B1, B3, B5, B7, B9, B11, B13, B15,
B17, B19, B21, B23, B25, B27, B29,
B31, B33, B39, B52, B60, B62, B64,
B66, B68, B70, B72, B74, B76, B78,
B80, B82, B84, B86, B88, B90, B92
B10
B12
B34
A20, B20, A22, B22, A24
A14
A12
A2, B2, A4, B4, A6, B6, A8, B8, A10
B32, A32, B30, A30, B28, A28, B26,
A26, B24
B16, A18, B18
A34
A16, B14, A38, B38, A40, B40, A43,
B43, A44, B44, A45, B45, A46, B46,
A47, B47, A48, B48, A49, B49, A50,
B50, A77, B79
B83
B81
B59
I/O Type
Description
Ground reference for RDRAM core and interface. 72 PCB
connector pads.
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Positive polarity.
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Negative polarity.
I
VCMOS
Serial Command used to read from and write to the control
registers. Also used for power management.
I
RSL
Column bus. 5-bit bus containing control and address infor-
mation for column accesses.
I
RSL
Clock to master. Interface clock used for transmitting RSL
signals to the Channel. Positive polarity.
I
RSL
Clock to master. Interface clock used for transmitting RSL
signals to the Channel. Negative polarity.
Data bus A. A 9-bit bus carrying a byte of read or write data
I/O RSL between the Channel and the RDRAM device. LDQA8 is
non-functional on modules with x16 RDRAM devices
Data bus B. A 9-bit bus carrying a byte of read or write data
I/O RSL between the Channel and the RDRAM device. LDQB8 is non-
functional on modules with x16 RDRAM devices.
I
RSL
Row bus. 3-bit bus containing control and address information
for row accesses.
I
VCMOS
Serial Clock input. Clock source used to read from and write
to the RDRAM control registers.
These pads are not connected. These 24 connector pads are
reserved for future use.
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Positive polarity.
I
RSL
Clock from master. Interface clock used for receiving RSL
signals from the Channel. Negative polarity.
I
VCMOS
Serial Command Input. Pin used to read from and write to the
control registers. Also used for power management.
Page 3
Version 1.4 July 2002
4페이지 MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
Absolute Maximum Ratings
Table 4: Absolute Maximum Ratings
Symbol
VI,ABS
VDD,ABS
TSTORE
TPLATE
Parameter
Voltage applied to any RSL or CMOS signal pad with respect to Gnd
Voltage on VDD with respect to Gnd
Storage temperature
Plate temperature
Min
- 0.3
- 0.5
- 50
-
DC Recommended Electrical Conditions
Table 5: DC Recommended Electrical Conditions
Symbol
Parameter and Conditions
Min
VDD
VCMOS
Supply voltage
CMOS I/O power supply at pad for 2.5V controllers:
CMOS I/O power supply at pad for 1.8V controllers:
2.50 - 0.13
VDD
1.8 - 0.1
VREF
VSPD
Reference voltage
Serial Presence Detector- Positive power supply
1.4 - 0.2
2.2
Max
VDD + 0.3
VDD + 1.0
100
92
Unit
V
V
°C
°C
Max
2.50 + 0.13
VDD
1.8 + 0.2
1.4 + 0.2
3.6
Unit
V
V
V
V
V
Table 6: RIMM Module Capacity and Number of RDRAM device
RIMM Module Capacity:
Number of 256/288Mb RDRAM devices
512/576MB
16
256/288MB
8
128/144MB
4
64/72MB
2
Page 6
Version 1.4 July 2002
7페이지 | |||
구 성 | 총 16 페이지수 | ||
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부품번호 | 상세설명 및 기능 | 제조사 |
MR18R1624AF0 | (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die | Samsung semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |