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PDF MGA-565P8 Data sheet ( Hoja de datos )

Número de pieza MGA-565P8
Descripción Agilent MGA-565P8 20 dBm Psat High Isolation Buffer Amplifier
Fabricantes Agilent Technologies 
Logotipo Agilent Technologies Logotipo



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Agilent MGA-565P8 20 dBm Psat
High Isolation Buffer Amplifier
Data Sheet
Description
The MGA-565P8 is designed for
use in LO chains to drive high
dynamic range passive mixers. It
provides high isolation, high gain,
and consistent output power. It
is a GaAs MMIC, fabricated using
Agilent Technologies’ cost
effective, reliable enhancement
mode PHEMT (Pseudomorphic
High Electron Mobility Transis-
tor)[1] process. This device is
housed in the LPCC 2x2 mm
package. This package offers
good thermal dissipation and RF
characteristics.
MGA-565P8 features a saturated
power of 20 dBm (with 0 dBm
input power) and reverse isola-
tion in excess of 40 dB at 2 GHz.
The saturated output power can
be set between 9 dBm and
20 dBm using an external resis-
tor, with a corresponding adjust-
ment in current consumption.
Notes:
1. Enhancement mode technology employs a
single positive Vgs, eliminating the need of
negative gate voltage associated with
conventional depletion mode devices.
2. Conform to JEDEC reference outline MO229
for DRP-N
Pin Connections and
Package Marking
Pin 8 GND
Pin 7
(RFout/VD1)
Pin 6 (VD2)
Pin 5 (VD3)
Pin 1 GND
Pin 2 (RFin)
Pin 3 GND
Pin 4 GND
Bottom View
Pin 1
Pin 8
1BxPin 2
Pin 7
Pin 3
Pin 6
Pin 4
Pin 5
Top View
Note:
Package marking provides orientation and
identification
“1B” = Device Code
“x” = Data code indicates the month of
manufacture.
Simplified Schematic
Vd
Id
5
2
Rbias
6
7
Features
• Up to 3.5 GHz operating frequency
• 2:1 VSWR input and output at 2GHz
• Small package size:
2.0 x 2.0 x 0.75 mm LPCC[3]
• MSL-1 and lead-free
• Tape-and-reel packaging option
available
Specifications
@ 2 GHz, Vd = 5V, Pin = 0 dBm
• Psat = 20 dBm
• Idsat = 67 mA
• Isolation = 42 dB
• Small Signal Gain = 22 dB
Applications
• VCO buffer amplifier for Cellular/PCS
or other wireless infrastructures
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
LO
1, 3, 4, 8

1 page




MGA-565P8 pdf
MGA-565P8 Typical Performance Curves (Rbias = 0, temperature variation)
20
19
18
17
16
15
14
13
12
11
10
800
25°C, 3V
85°C, 3V
-45°C, 3V
2000
FREQUENCY (MHz)
Figure 10. Psat vs. Frequency.
(Pin = 0 dBm, Vd = 3V)
90
80
70
60
50
40 25°C, 5V
85°C, 5V
30 -45°C, 5V
20
10
800
2000
FREQUENCY (MHz)
Figure 13. Idsat vs. Frequency.
(Pin = 0 dBm, Vd = 5V)
24
22
20
18
16 25°C, 5V
85°C, 5V
14 -45°C, 5V
12
10
3500 800
2000
FREQUENCY (MHz)
Figure 11. Psat vs. Frequency.
(Pin = 0 dBm, Vd = 5V)
28
26
24
22
20
18
25°C, 3V
16 85°C, 3V
-45°C, 3V
14
12
10
3500 800
2000
FREQUENCY (MHz)
Figure 14. Gain vs. Frequency.
(Pin = -10 dBm, Vd = 3V)
3500
3500
55
50
45
40
35
30
25°C, 3V
25 85°C, 3V
-45°C, 3V
20
15
10
800
2000
FREQUENCY (MHz)
Figure 12. Idsat vs. Frequency.
(Pin = 0 dBm, Vd = 3V)
30
28
26
24
22
20
18
16
14
12
10
800
25°C, 5V
85°C, 5V
-45°C, 5V
2000
FREQUENCY (MHz)
Figure 15. Gain vs Frequency.
(Pin = -10 dBm, Vd = 5V)
3500
3500
5

5 Page





MGA-565P8 arduino
PCB Land Pattern and Stencil Design
PIN 1
φ0.20 (7.87)
Solder
mask
2.80 (110.24)
0.70 (27.56)
0.25 (9.84)
0.25 (9.84)
PIN 1
0.50 (19.68)
1.60 (62.99)
+ 0.28 (10.83)
2.72 (107.09)
0.63 (24.80)
0.22 (8.86)
0.32 (12.79)
0.50 (19.68)
1.54 (60.61)
0.25 (9.74)
RF
transmission
line
0.80 (31.50)
0.15 (5.91)
0.55 (21.65)
0.60 (23.62)
PCB Land Pattern (top view)
Notes: Typical stencil thickness is 5 mils.
Measurements are in millimeters (mils).
0.72 (28.35)
0.63 (24.80)
Stencil Layout (top view)
Device Orientation
REEL
4 mm
USER
FEED
DIRECTION
CARRIER
TAPE
8 mm
1BX 1BX 1BX 1BX
COVER TAPE
11

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