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PDF LM61 Data sheet ( Hoja de datos )
| Número de pieza | LM61 | |
| Descripción | 2.7V/ SOT-23 or TO-92 Temperature Sensor | |
| Fabricantes | National Semiconductor | |
| Logotipo |  |
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June 1999
LM61
2.7V, SOT-23 or TO-92 Temperature Sensor
General Description
The LM61 is a precision integrated-circuit temperature sen-
sor that can sense a −30˚C to +100˚C temperature range
while operating from a single +2.7V supply. The LM61’s out-
put voltage is linearly proportional to Celsius (Centigrade)
temperature (+10 mV/˚C) and has a DC offset of +600 mV.
The offset allows reading negative temperatures without the
need for a negative supply. The nominal output voltage of the
LM61 ranges from +300 mV to +1600 mV for a −30˚C to
+100˚C temperature range. The LM61 is calibrated to pro-
vide accuracies of ±2.0˚C at room temperature and ±3˚C
over the full −25˚C to +85˚C temperature range.
The LM61’s linear output, +600 mV offset, and factory cali-
bration simplify external circuitry required in a single supply
environment where reading negative temperatures is re-
quired. Because the LM61’s quiescent current is less than
125 µA, self-heating is limited to a very low 0.2˚C in still air.
Shutdown capability for the LM61 is intrinsic because its in-
herent low power consumption allows it to be powered di-
rectly from the output of many logic gates.
Features
n Calibrated linear scale factor of +10 mV/˚C
n Rated for full −30˚ to +100˚C range
n Suitable for remote applications
Applications
n Cellular Phones
n Computers
n Power Supply Modules
n Battery Management
n FAX Machines
n Printers
n HVAC
n Disk Drives
n Appliances
Key Specifications
n Accuracy at 25˚C
n Accuracy for −30˚C to +100˚C
n Accuracy for −25˚C to +85˚C
n Temperature Slope
n Power Supply Voltage Range
n Current Drain @ 25˚C
n Nonlinearity
n Output Impedance
Typical Application
±2.0 or ±3.0˚C
(max)
±4.0˚C (max)
±3.0˚C (max)
+10 mV/˚C
+2.7V to +10V
125 µA (max)
±0.8˚C (max)
800 Ω (max)
DS012897-2
VO = (+10 mV/˚C x T ˚C) + 600 mV
Temperature (T) Typical VO
+100˚C
+1600 mV
+85˚C
+1450 mV
+25˚C
+850 mV
0˚C +600 mV
−25˚C
+350 mV
−30˚C
+300 mV
FIGURE 1. Full-Range Centigrade Temperature Sensor (−30˚C to +100˚C)
Operating from a Single Li-Ion Battery Cell
© 1999 National Semiconductor Corporation DS012897
www.national.com
1 page  
Typical Performance Characteristics The LM61 in the SOT-23 package mounted to a printed
circuit board as shown in Figure 2 was used to generate the following thermal curves. (Continued)
Supply Voltage
vs Supply Current
Start-Up Response
DS012897-12
DS012897-22
DS012897-14
FIGURE 2. Printed Circuit Board Used
for Heat Sink to Generate All Curves.
1⁄2" Square Printed Circuit Board
with 2 oz. Copper Foil or Similar.
1.0 Mounting
The LM61 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or ce-
mented to a surface. The temperature that the LM61 is sens-
ing will be within about +0.2˚C of the surface temperature
that LM61’s leads are attached to.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the ac-
tual temperature measured would be at an intermediate tem-
perature between the surface temperature and the air tem-
perature.
To ensure good thermal conductivity the backside of the
LM61 die is directly attached to the GND pin. The lands and
traces to the LM61 will, of course, be part of the printed cir-
cuit board, which is the object whose temperature is being
measured.
Alternatively, the LM61 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM61 and
accompanying wiring and circuits must be kept insulated and
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where conden-
sation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to en-
sure that moisture cannot corrode the LM61 or its connec-
tions.
The thermal resistance junction to ambient (θJA) is the pa-
rameter used to calculate the rise of a device junction tem-
perature due to its power dissipation. For the LM61 the
equation used to calculate the rise in the die temperature is
as follows:
TJ = TA + θJA [(+VS IQ) + (+VS − VO) IL]
where IQ is the quiescent current and ILis the load current on
the output. Since the LM61’s junction temperature is the ac-
tual temperature being measured care should be taken to
minimize the load current that the LM61 is required to drive.
The table shown in Figure 3 summarizes the rise in die tem-
perature of the LM61 without any loading with a 3.3V supply,
and the thermal resistance for different conditions.
5 www.national.com
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| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet LM61.PDF ] | |
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