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PEF2260 데이터시트 PDF




Infineon Technologies에서 제조한 전자 부품 PEF2260은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 PEF2260 자료 제공

부품번호 PEF2260 기능
기능 (PEF2260 / PEF2060) Signal Processing Codec Filter
제조업체 Infineon Technologies
로고 Infineon Technologies 로고


PEF2260 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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PEF2260 데이터시트, 핀배열, 회로
ICs for Communications
Signal Processing Codec Filter
SICOFI®, SICOFI®-2
User’s Manual 03.92




PEF2260 pdf, 반도체, 판매, 대치품
Contents
Table of Contents (cont’d)
Page
Detailed Description of Hardware Tools........................................................................ 326
SICOFI® Test Board STUT 2060...................................................................................... 326
SICOFI®-2 Module for the Siemens ISDN PC User Board (SIPB 5135) ........................... 358
SLIC Babyboard STUS 5502 for HARRIS SLIC HC 5502................................................. 386
SLIC Babyboard STUS 5509 for HARRIS SLIC HC 5509................................................. 398
SLIC Babyboard STUS 3762 for ERICSSON SLIC PBL 3736 .......................................... 411
SLIC Babyboard STUS 3762 for ERICSSON SLIC PBL 3762/64 ..................................... 423
SLIC Babyboard STUS 3030 for STM SLIC L3000 / L3030 .............................................. 437
SLIC Babyboard STUS 3090 for STM SLIC L3000 / L3090 .............................................. 453
SLIC Babyboard STUS 1001 for Transformer SLIC .......................................................... 466
Application Notes ............................................................................................................ 475
I SICOFI® Application Together with HARRIS-SLIC HC 5502 ............................ 475
II SICOFI® Application Together with ERICSSON SLIC PBL 3762...................... 502
III SICOFI® Application Together with STM SLIC L3000 /L3030........................... 548
IV SICOFI® Application Together with STM SLIC L3000 /L3090........................... 594
V SICOFI® Application Together with Transformer SLIC with
Series Feeding.................................................................................................... 629
VI SICOFI® Application Together with Transformer SLIC
with Transverse Feeding .................................................................................... 658
VII SICOFI® Application Together with Transformer SLIC
for USA Specification.......................................................................................... 710
VIII SICOFI® Layout Recommendation for Analog Line-Card Applications ............. 723
IX Using SICOFI®-2 (PEB 2260) in IOM®-2 Mode .................................................. 728
X DAML Simulation Using the SIPB 5000 Userboard System............................... 744
IOM®, IOM®-1, IOM®-2, SICOFI®, SICOFI®-2, SICOFI®-4, SICOFI®-4µC, SLICOFI®, ARCOFI® , ARCOFI®-BA, ARCOFI®-SP,
EPIC®-1, EPIC®-S, ELIC®, IPAT®-2, ITAC®, ISAC®-S, ISAC®-S TE, ISAC®-P, ISAC®-P TE, IDEC®, SICAT®, OCTAT®-P,
QUAT®-S are registered trademarks of Siemens AG.
MUSAC-A, FALC54, IWE, SARE, UTPT, ASM, ASPare trademarks of Siemens AG.
Purchase of Siemens I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C-system
provided the system conforms to the I2C specifications defined by Philips. Copyright Philips 1983.
Semiconductor Group
4

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PEF2260 전자부품, 판매, 대치품
General Information
Storage and Pretreatment of SMD ICs
The components should be stored in a dry place. Some large and specially identified plastic
ICs have to be processed in a dry condition. This is produced by dry packing or by means
of a separate drying process shortly before they are processed (e.g. 16 h at 125 °C)
3 Processing Guidelines for ICs
Integrated circuits (ICs) are electrostatic-sensitive (ESS) devices. The demand for
greater packing density has led to smaller structures on semiconductor chips, with the
result that today every IC, whether bipolar, MOS, or CMOS, has to be protected against
electrostatics.
MOS and CMOS devices generally have integrated protective circuits and it is virtually
impossible for them to be destroyed by purely static electricity. On the other hand, there
is acute danger from electrostatic discharges (ESD).
Of the multitude of possible sources of discharge, charged devices should be mentioned
in addition to charged persons. Low-resistive discharges can produce peak powers
amounting to kilowatts.
For the protection of devices the following principles should be observed:
a) Reduction of charging voltage, below 200 V if possible.
Means which are effective here are an increase in relative humidity to 60 % and
the replacement of highly charging plastics by antistatic materials.
b) With every kind of contact with the device pins a charge equalization is to be
expected. This should always be highly resistive (ideally R = 106 to 109 ).
All in all this means that ICs call for special handling, because uncontrolled charges,
voltages from ungrounded equipment or persons, surge voltage spikes and similar
influences can destroy a device. Even if devices have protective circuits (e.g. protective
diodes) on their inputs, the following guidelines for their handling should nevertheless be
observed.
Identification
The packing of ESS devices is provided with the following label by the
manufacturer:
Scope
The guidelines apply to the storage, transport, testing, and processing of all kinds of ICs,
equipped and soldered circuit boards that comprise such components.
Semiconductor Group
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-----------------------------------------------------------------------

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관련 데이터시트

부품번호상세설명 및 기능제조사
PEF2260

(PEF2260 / PEF2060) Signal Processing Codec Filter

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