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부품번호 | LDH54xxxx 기능 |
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기능 | (LDH Series) Chip Multilayer Delay Lines | ||
제조업체 | Murata Manufacturing | ||
로고 | |||
!Note •PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
N91E7.pdf 03.5.13
•TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocnt ss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacl tsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering.
Chip Multilayer Delay Lines
Chip Multilayer Delay Lines
1
3.2±0.2
1.1±0.2
This Delay Line was developed by applying ceramic
(3) (2) (1)
multilayering and hole technology. It consists of
copper line and low dielectric constant material and
incorporates metal shields. LDH series are very small
(4) (8)
(5) (6) (7)
0.25+0.1/-0.15
and made for use at high frequencies.
0.35±0.2 0.45±0.15
s Features
(1)(3)(5)(7) : NC
(2)(6) : GND
(4)(8) : IN/OUT
1. High stability at high frequency (2GHz)
0.5±0.1
1.0±0.1
(in mm)
2. Small, thin and light, utilizing multilayer
construction
m3. Metal shield is built inside chip.
4. Reflow solderable
o5. Supplied on tape
Sheet4U.c0.6±0.1
.DataDirectional
Input Mark
(1) (2) (3)
(8) (4)
(7) (6) (5)
0.4±0.2
4.5±0.2
1.1±0.2
wwwLDH43 Series
0.35±0.10
1.27±0.10
(1)(3)(4)(5)(7)(8) : GND
(2)(6)
: IN/OUT
(in mm)
All the technical data and information contained herein are
subject to change without prior notice.
LDH31 Series
Terminal of "NC" should not be fixed to any pattern.
All the technical data and information contained herein are subject
to change without prior notice.
3.2±0.2
(3) (2) (1)
1.5±0.15
(4) (8)
LDH32 Series
(5) (6) (7)
0.1min. 0.45±0.15 1.0±0.2
0.55±0.15
0.4±0.2
(1)(3)(5)(7) : NC
(2)(6) : GND
(4) : IN/OUT
(8) : IN/OUT
(in mm)
Terminal of "NC" should not be fixed
to any pattern.
All the technical data and information
contained herein are subject to
change without prior notice.
LDH54 Series
5.0±0.3
1.1–3.1 1.27±0.2
0.3max.
(1) (2) (3)
0.35±0.2
(6) (5) (4)
0.8±0.2
1.27±0.2
(1)(3) : IN / OUT
(2)(4)
(5)(6)
:
GND
(in mm)
LDH65 Series
6.3±0.3
0.6 min. 0.4 min.
0.5 min. 1.27±0.2
2.5 max.
0.5 min. 0.3 max.
(1) (2) (3) (4)
(8) (7) (6) (5)
(1)(5) : IN / OUT
(2)(3)(4)
(6)(7)(8)
:
GND
(in mm)
www.DataSheet4U.comLDHA2 Series
10.0±0.3
0.5 min. 0.4 min.
0.4 min. 2.54±0.2
3.7 max.
0.8 min. 0.3 max.
(1) (2) (3) (4)
(10) (5)
(9) (8) (7) (6)
1.4±0.3
(1)(6) : IN / OUT
(2)(3)(4)
(5)(7)(8)
: GND
(9)(10)
(in mm)
Cat.No.N91E-71
!Note •PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
N91E7.pdf 03.5.13
•TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocntss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacltsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering.
1 Soldering and Mounting
s Standard Land Dimensions
LDH31 Series
1.00 2.60 1.00
0.60
LDH32 Series
1.5 2.2 1.5
Land
Solder resist
No pattern
Solder resist
∗
0.70
0.30
0.30
1.05
0.25
0.45
∗
Land
Solder resist
No pattern Solder resist
∗Line width to be designd to match 50ohm
characteristic impedance, depending
on PCB material and thickness.
All the technical data and Information
contained herein are subject
to change without prior notice.
(in mm)
1.0
0.4
1.25 0.05
0.7 0.3 0.7
Line width to be designed to match 50Ω characteristic impedance,
depending on PCB material and thickness.
All the technical data and Information contained
herein are subject to change without prior notice.
(in mm)
LDH43 Series
0.6
3.5
1.0
0.6 1.27
(in mm)
Land
All the technical data and information contained herein are subject to change without prior notice.
LDH54 Series
0.37 0.37
0.9 0.9 0.9
Land
Solder resist
No pattern
Solder resist
∗
∗
∗
∗Line width to be designed to match 50ohm characteristic
impedance, depending on PCB material and thickness.
(in mm)
LDH65 Series
Land
Solder Resist
No Pattern
Solder Resist
LDHA2 Series
*
*
Land
Solder Resist
No Pattern
Solder Resist
**
0.37
2.17
2.91
4.71
* Line width to be designed to match 50Ω characteristic
impedance, depending on PCB material and thickness.
(in mm)
1.34
3.74
6.42
6.6
8.82
11.0
* Line width to be designed to match 50Ω characteristic
impedance, depending on PCB material and thickness.
(in mm)
4
4페이지 !Note •PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
N91E7.pdf 03.5.13
•TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocntss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacltsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering.
s Notice (Storage and Operating Condition)
To avoid damaging the solderability of the external
electrodes, be sure to observe the following points.
o Store products where the ambient temperature is 15 to
35°C and the relative humidity is 45 to 75% RH.
(Packing materials, in particular, may be deformed at
temperatures over 40°C.).
o Bulk packed chip components should be used as soon as
the seal is opened, thus preventing the solderability from
deteriorating. The remaining unused components should
be put in the original bag and resealed, or stored in a
desiccator containing a desiccating agent.
o Store products in non-corrosive gas (Cl2, NH3, SO2, Nox,
etc.).
o Stored products should be used within 6 months of
receipt. Solderability should be verified if this period is
exceeded.
s Notice (Rating)
Products should be used in an input power capacity as
specified in this catalog.
Consult with Murata beforehand if a different input
power capacity range is required.
Notice 1
7
7페이지 | |||
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부품번호 | 상세설명 및 기능 | 제조사 |
LDH54xxxx | (LDH Series) Chip Multilayer Delay Lines | Murata Manufacturing |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |