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PDF OM1654 Data sheet ( Hoja de datos )
| Número de pieza | OM1654 | |
| Descripción | Simple Zero Crossing Triac Control Circuit | |
| Fabricantes | IES | |
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Data Sheet
INTEGRATED CIRCUIT
2002 Nov 08
OM1654A &
OM1654
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INTEGRATED ELECTRONIC SOLUTIONS
1BUTLER DRIVE
HENDON SA 5014
AUSTRALIA
www.DataSheet4U.com
1 page  
Integrated Electronic Solutions, Hendon, South Australia
Simple zero-crossing triac control circuit
Data Sheet
OM1654A & OM1654
6 FUNCTIONAL DESCRIPTION
6.1 COM − Common, positive
DC supply
The positive DC supply rail for the
control IC OM1654A and 0M1654 is
used as the Common reference. This
is connected to the Tl terminal of the
triac, and being the positive supply
rail enables negative gate drive to the
triac in both positive and negative
supply half cycles on T2. By driving
the triac in this way the insensitive
quadrant (negative T2 voltage, and
positive gate triggering signal) is
avoided.
6.2 SUBS − Substrate, negative
DC supply
The substrate connection is the
negative DC power supply terminal of
the OM1654. This should be
bypassed to COM by a filtering
capacitor of 47 microfarads. The
operating voltage is approximately
−6.8 volts. This capacitor needs to be
sufficiently large to maintain the
operating voltage during the half cycle
when it is not being charged, as well
as to provide the energy to drive the
triac gate during the gate pulse.
6.3 AC − AC signal, power
supply and synchronisation
For the OM1654A the AC input is
connected to the active mains supply
rail via a resistor chosen to give the
required gate pulse width, chosen to
ensure that during zero crossing of
the mains cycle, the gate signal is
applied from before the load current
falls below the triac holding current,
until after the load current has
increased to a value greater than the
triac latching current. A resistor from
PWR to SUBS may be required to
ensure the gate drive pulse is still
present when the negative mains
voltage is insufficient for the load
current to have reached the negative
latching current.
In the simplest application (optimised
for a 400W load), the AC input is
connected via a 220 kΩ resistor to the
220/250 volt AC mains supply line.
The AC input signal is rectified to
provide some of the internal supply
voltage, and also provides the
synchronising information required by
the OM1654 to generate the zero
crossing signal.
6.4 PWR − Power supply
The OM1654A has an extra pin
(PWR) which allows a further resistor
to be used to provide an adequate DC
power supply while also permitting
easy adjustment of the gate pulse
width via the AC pin.
The PWR pin is driven by a resistor
from the mains Active. This resistor is
chosen to ensure that the DC power
supply is sufficient to provide the
power supply necessary for the
function of the OM1654A, and in
addition to provide the energy needed
for the gate drive. These calculations
are described in the OM1654
application note.
6.5 G − Triac gate drive
The triac gate drive output is
designed to be connected directly to
the gate. It has inbuilt protection to
withstand transient signals which may
be induced on the gate of the triac by
mains transients during firing. The
gate drive is designed for a triac with
a gate sensitivity which requires less
than 10 mA of triggering current, and
a suitable latching current. One triac
with suitable characteristics is the
BT137 series E when used with a
load of more than 400 watts.
6.6 CAP − Timing capacitor
The timing capacitor is connected
between this pin and the substrate
(−ve). The discharge time of this
capacitor sets the triac ON time, and
is proportional to the capacitance
value (approximately 4 seconds per
micro farad). The charging period, or
OFF time, varies with the magnitude
of the input signal from the sensor.
The ON period is synchronised with
the mains zero crossing signals so
that an integral number of full cycles
makes up the ON period, and no nett
DC signal is generated in the supply
line. The initiation of an ON period is
suppressed until the chip power
supply reaches its regulated value.
After reaching a valid VEE the chip will
stay in operation even if the supply
falls to about 4 volts. It won’t start until
the “zener” first conducts.
6.7 SENS − Sensor input
The sensor input is designed to
accept an input which is an AC signal
referenced to common; thereby
avoiding problems associated with
the power dissipation involved in
generating sufficient DC current to
drive the sensor over its full operating
resistance range. If a suitable
resistive sensor is used with a parallel
level setting potentiometer to apply a
proportion of the AC sensor signal to
the SENS input, a typical circuit will
power this via a 220 kΩ resistor from
the AC supply. The SENS input signal
threshold is one VBE below the COM
rail. Signals with a magnitude greater
than this threshold charge the timing
capacitor towards the COM rail until it
reaches the threshold which initiates
an ON cycle. Signals with a
magnitude less than this do not
charge the capacitor, and the triac
drive remains OFF.
External circuits may be used to give
greater temperature linearity and
accuracy, and improved performance
with variation in ambient temperature.
The SENS input is only active on
negative signals with respect to COM,
and therefore either a full AC input
may be used, or a signal that is only
negatively going with respect to COM.
2002 Nov 08
5
5 Page 
Integrated Electronic Solutions, Hendon, South Australia
Simple zero-crossing triac control circuit
Data Sheet
OM1654A & OM1654
11 SOLDERING
11.1 Introduction
There is no soldering method that is
ideal for all IC packages. Wave
soldering is often preferred when
through-hole and surface mounted
components are mixed on one
printed-circuit board. However, wave
soldering is not always suitable for
surface mounted ICs, or for
printed-circuits with high population
densities. In these situations reflow
soldering is often used.
This text gives a very brief insight to a
complex technology. A more in-depth
account of soldering ICs can be found
in the Philips “IC Package Data book”
(code 9398 652 90011).
11.2 DIP
11.2.1 SOLDERING BY DIPPING OR BY
WAVE
The maximum permissible
temperature of the solder is 260 °C;
solder at this temperature must not be
in contact with the joint for more than
5 seconds. The total contact time of
successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the
seating plane, but the temperature of
the plastic body must not exceed the
specified maximum storage
temperature (Tstg max). If the
printed-circuit board has been
pre-heated, forced cooling may be
necessary immediately after
soldering to keep the temperature
within the permissible limit.
11.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron
(less than 24 V) to the lead(s) of the
package, below the seating plane or
not more than 2 mm above it. If the
temperature of the soldering iron bit is
less than 300 °C it may remain in
contact for up to 10 seconds. If the bit
temperature is between
300 and 400 °C, contact may be up to
5 seconds.
11.3 SO
11.3.1 REFLOW SOLDERING
Reflow soldering techniques are
suitable for all SO packages.
Reflow soldering requires solder
paste (a suspension of fine solder
particles, flux and binding agent) to be
applied to the printed-circuit board by
screen printing, stencilling or
pressure-syringe dispensing before
package placement.
Several techniques exist for
reflowing; for example, thermal
conduction by heated belt. Dwell
times vary between
50 and 300 seconds depending on
heating method. Typical reflow
temperatures range from
215 to 250 °C.
Preheating is necessary to dry the
paste and evaporate the binding
agent. Preheating duration:
45 minutes at 45 °C.
11.3.2 WAVE SOLDERING
Wave soldering techniques can be
used for all SO packages if the
following conditions are observed:
• A double-wave (a turbulent wave
with high upward pressure followed
by a smooth laminar wave)
soldering technique should be
used.
• The longitudinal axis of the
package footprint must be parallel
to the solder flow.
• The package footprint must
incorporate solder thieves at the
downstream end.
During placement and before
soldering, the package must be fixed
with a droplet of adhesive. The
adhesive can be applied by screen
printing, pin transfer or syringe
dispensing. The package can be
soldered after the adhesive is cured.
Maximum permissible solder
temperature is 260 °C, and maximum
duration of package immersion in
solder is 10 seconds, if cooled to less
than 150 °C within 6 seconds. Typical
dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate
the need for removal of corrosive
residues in most applications.
11.3.3 REPAIRING SOLDERED JOINTS
Fix the component by first soldering
two diagonally- opposite end leads.
Use only a low voltage soldering iron
(less than 24 V) applied to the flat part
of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other
leads can be soldered in one
operation within 2 to 5 seconds
between 270 and 320 °C.
2002 Nov 08
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet OM1654.PDF ] | |
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