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부품번호 | TE28F320C3 기능 |
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기능 | (TE28FxxxC3) Boot Block Flash Memory | ||
제조업체 | Intel | ||
로고 | |||
전체 30 페이지수
Intel® Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
■ Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
m— 12 V for fast production programming
■ 1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
oOption
.c—Reduces overall system power
■ High Performance
— 2.7 V– 3.6 V: 70 ns max access time
U■ Optimized Architecture for Code Plus
Data Storage
t4—Eight 4 Kword blocks, top or bottom
parameter boot
e— Up to 127 x 32 Kword blocks
— Fast program suspend capability
e— Fast erase suspend capability
■ Flexible Block Locking
h— Lock/unlock any block
— Full protection on power-up
S— Write Protect (WP#) pin for hardware
block protection
ta■ Low Power Consumption
— 9 mA typical read
a— 7 uA typical standby with Automatic
Power Savings feature
.D■ Extended Temperature Operation
— -40 °C to +85 °C
■ 128-bit Protection Register
—64 bit unique device identifier
—64 bit user programmable OTP cells
■ Extended Cycling Capability
—Minimum 100,000 block erase cycles
■ Software
—Supported by Intel’s Advanced Flash
File Managers -- Intel® VFM, Intel®
FDI, etc.
—Code and data storage in the same
memory device
—Robust Power Loss Recovery for Data
Loss Prevention
—Common Flash Interface
— http://www.intel.com/go/flashsw
■ Standard Surface Mount Packaging
—48-Ball µBGA*/VFBGA
—64-Ball Easy BGA packages
—48-TSOP package
■ ETOX™ VIII (0.13 µm) Flash
Technology
—8, 16, 32 Mbit
■ ETOX™ VII (0.18 µm) Flash Technology
—16, 32 Mbit
■ ETOX™ VI (0.25 µm) Flash Technology
—8, 16 and 32 Mbit
wThe Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power
wapplications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
mindependently locked or unlocked. Add to this the Intel® Flash Data Integrator (Intel® FDI)
w osoftware and you have a cost-effective, flexible, monolithic code plus data storage solution.
.cIntel® Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
Uball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
t4obtained from the Intel® Flash website: http://www.intel.com/design/flash.
.DataSheeOrder Number: 290645, Revision: 023
www May 2005
Intel® Advanced+ Boot Block Flash Memory (C3)
9.1 Bus Operations ................................................................................................................... 39
9.1.1 Read ...................................................................................................................... 39
9.1.2 Write ...................................................................................................................... 39
9.1.3 Output Disable ....................................................................................................... 39
9.1.4 Standby.................................................................................................................. 40
9.1.5 Reset ..................................................................................................................... 40
10.0 Modes of Operation..................................................................................................................... 41
10.1 Read Mode ......................................................................................................................... 41
10.1.1 Read Array............................................................................................................. 41
10.1.2 Read Identifier ....................................................................................................... 41
10.1.3 CFI Query .............................................................................................................. 42
10.1.4 Read Status Register............................................................................................. 42
10.1.4.1 Clear Status Register............................................................................. 43
10.2 Program Mode .................................................................................................................... 43
10.2.1 12-Volt Production Programming........................................................................... 43
10.2.2 Suspending and Resuming Program..................................................................... 44
10.3 Erase Mode ........................................................................................................................ 44
10.3.1 Suspending and Resuming Erase ......................................................................... 45
11.0 Security Modes ............................................................................................................................ 49
11.1 Flexible Block Locking ........................................................................................................ 49
11.1.1 Locking Operation.................................................................................................. 50
11.1.1.1 Locked State .......................................................................................... 50
11.1.1.2 Unlocked State....................................................................................... 50
11.1.1.3 Lock-Down State.................................................................................... 50
11.2 Reading Block-Lock Status................................................................................................. 50
11.3 Locking Operations during Erase Suspend ........................................................................ 51
11.4 Status Register Error Checking .......................................................................................... 51
11.5 128-Bit Protection Register................................................................................................. 51
11.5.1 Reading the Protection Register............................................................................ 52
11.5.2 Programming the Protection Register.................................................................... 52
11.5.3 Locking the Protection Register............................................................................. 52
11.6 VPP Program and Erase Voltages ...................................................................................... 52
11.6.1 Program Protection................................................................................................ 53
A Write State Machine States......................................................................................................... 54
B Flow Charts .................................................................................................................................. 56
C Common Flash Interface............................................................................................................. 62
C.1 Query Structure Output....................................................................................................... 62
C.2 Query Structure Overview .................................................................................................. 63
C.3 Block Status Register ......................................................................................................... 64
C.4 CFI Query Identification String............................................................................................ 65
C.5 Device Geometry Definition ................................................................................................ 66
C.6 Intel-Specific Extended Query Table .................................................................................. 68
D Additional Information ................................................................................................................ 70
E Ordering Information................................................................................................................... 71
May 2005
4
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
Datasheet
4페이지 1.0
1.1
1.2
Intel® Advanced+ Boot Block Flash Memory (C3)
Introduction
This datasheet contains the specifications for the Intel® Advanced+ Boot Block Flash Memory
(C3) device family, hereafter called the C3 flash memory device. These flash memories add
features such as instant block locking and protection registers that can be used to enhance the
security of systems.
Nomenclature
0x
0b
Byte
Word
KW or Kword
Mword
Kb
KB
Mb
MB
APS
CSP
CUI
OTP
PR
PRD
PLR
RFU
SR
SRD
WSM
Hexadecimal prefix
Binary prefix
8 bits
16 bits
1024 words
1,048,576 words
1024 bits
1024 bytes
1,048,576 bits
1,048,576 bytes
Automatic Power Savings
Chip Scale Package
Command User Interface
One Time Programmable
Protection Register
Protection Register Data
Protection Lock Register
Reserved for Future Use
Status Register
Status Register Data
Write State Machine
Conventions
The terms pin and signal are often used interchangeably to refer to the external signal connections
on the package; for chip scale package (CSP) the term ball is used.
Group Membership Brackets: Square brackets will be used to designate group membership or to
define a group of signals with similar function (i.e. A[21:1], SR[4:1])
Set: When referring to registers, the term set means the bit is a logical 1.
Clear: When referring to registers, the term clear means the bit is a logical 0.
Block: A group of bits (or words) that erase simultaneously with one block erase instruction.
Main Block: A block that contains 32 Kwords.
Parameter Block: A block that contains 4 Kwords.
Datasheet
Intel® Advanced+ Boot Block Flash Memory (C3)
Order Number: 290645, Revision: 023
May 2005
7
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부품번호 | 상세설명 및 기능 | 제조사 |
TE28F320C3 | (TE28Fxxx) 3 Volt Advanced Boot Block Flash Memory | Intel Corporation |
TE28F320C3 | (TE28FxxxC3) Boot Block Flash Memory | Intel |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |