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부품번호 | NTGS3446 기능 |
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기능 | Power MOSFET 5.1 Amp 20 Volts | ||
제조업체 | ON Semiconductor | ||
로고 | |||
전체 4 페이지수
NTGS3446
Power MOSFET
5.1 Amps, 20 Volts
N−Channel TSOP−6
Features
• Ultra Low RDS(on)
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
http://onsemi.com
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
• IDSS Specified at Elevated Temperature
m• Pb−Free Package is Available
oApplications
.c• Power Management in portable and battery−powered products, i.e.
computers, printers, PCMCIA cards, cellular and cordless
• Lithium Ion Battery Applications
• Notebook PC
t4UMAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
eDrain−to−Source Voltage
eGate−to−Source Voltage
Thermal Resistance
hJunction−to−Ambient (Note 1)
Total Power Dissipation @ TA = 25°C
SDrain Current
− Continuous @ TA = 25°C
− Pulsed Drain Current (tp t 10 ms)
taThermal Resistance
Junction−to−Ambient (Note 2)
aTotal Power Dissipation @ TA = 25°C
Drain Current
− Continuous @ TA = 25°C
.D− Pulsed Drain Current (tp t 10 ms)
Thermal Resistance
Junction−to−Ambient (Note 3)
wTotal Power Dissipation @ TA = 25°C
Drain Current
− Continuous @ TA = 25°C
w− Pulsed Drain Current (tp t 10 ms)
Source Current (Body Diode)
w .comOperating and Storage Temperature Range
VDSS
VGS
20
±12
V
V
RqJA
Pd
ID
IDM
244 °C/W
0.5 W
2.5 A
10 A
RqJA
Pd
ID
IDM
128 °C/W
1.0 W
3.6 A
14 A
RPqJdA
ID
IDM
IS
TJ, Tstg
62.5
2.0
5.1
20
5.1
−55 to
150
°C/W
W
A
A
A
°C
UMaximum Lead Temperature for Soldering
t4Purposes for 10 seconds
TL 260 °C
eMaximum ratings are those values beyond which device damage can occur.
eMaximum ratings applied to the device are individual stress limit values (not
hnormal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
Sreliability may be affected.
ta1. Minimum FR−4 or G−10PCB, operating to steady state.
a2. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick
single−sided), operating to steady state.
.D3. Mounted onto a 2” square FR−4 board (1” sq. 2 oz. cu. 0.06” thick
single−sided), t < 5.0 seconds.
ww Semiconductor Components Industries, LLC, 2005
wMarch, 2005 − Rev. 4
1
V(BR)DSS
20 V
RDS(on) TYP
36 mW @ 4.5 V
ID MAX
5.1 A
N−Channel
Drain 1 2 5 6
Gate 3
Source 4
MARKING
DIAGRAM
TSOP−6
CASE 318G
446W
1 STYLE 1
1
446 = Device Code
W = Work Week
PIN ASSIGNMENT
Drain Drain Source
654
1 23
Drain Drain Gate
ORDERING INFORMATION
Device
Package
Shipping†
NTGS3446T1
TSOP−6 3000/Tape & Reel
NTGS3446T1G
TSOP−6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTGS3446/D
NTGS3446
PACKAGE DIMENSIONS
A
L
65 4
S
12 3
B
D
G
0.05 (0.002)
H
C
TSOP−6
CASE 318G−02
ISSUE N
M
J
K
SOLDERING FOOTPRINT*
2.4
0.094
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 2.90 3.10 0.1142 0.1220
B 1.30 1.70 0.0512 0.0669
C 0.90 1.10 0.0354 0.0433
D 0.25 0.50 0.0098 0.0197
G 0.85 1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040
J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.55 0.0493 0.0610
M 0 _ 10 _ 0 _ 10 _
S 2.50 3.00 0.0985 0.1181
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
1.9
0.075
0.95
0.037
0.95
0.037
1.0
0.039
0.7
0.028
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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http://onsemi.com
4
ON Semiconductor Website: http://onsemi.com
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For additional information, please contact your
local Sales Representative.
NTGS3446/D
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DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |