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PDF 38F2240WWZ0Q1 Data sheet ( Hoja de datos )
| Número de pieza | 38F2240WWZ0Q1 | |
| Descripción | RD38F2240 | |
| Fabricantes | Intel | |
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Intel® Wireless Flash Memory
(W18/W30 SCSP)
32WQ and 64WQ Family with Asynchronous RAM
Product Features
Datasheet
■ Device Architecture
— Flash Density: 32-Mbit, 64-Mbit
— Async PSRAM Density: 8-, 16-, 32-
Mbit; Async SRAM Density: 4-, 8-, 16-
Mbit
— Top, Bottom or Dual flash parameter
configuration
■ Device Voltage
— Flash VCC = 1.8 V; Flash VCCQ = 1.8 V
or 3.0 V
— RAM VCC = 3.0 V; RAM VCCQ = 1.8 V
or 3.0 V
■ Device Packaging
— 88 balls (8 x 10 active ball matrix);
Area: 8x10 mm; Height: 1.2 mm to 1.4
mm
■ PSRAM Performance
— 70 ns initial access, 25 ns async page
reads at 1.8 V I/O
— 70 ns initial access async PSRAM at
1.8V I/O
— 88 ns initial access, 30 ns async page
reads at 1.8 V I/O
— 85 ns initial access, 35 ns async page
reads at 3.0 V I/O
— 70 ns initial access, 25 ns async page
reads at 3.0 V I/O
■ SRAM Performance
— 70 ns initial access at 1.8 V or 3.0 V I/O
■ Flash Performance
— 65 ns initial access at 1.8 V I/O
— 70 ns initial access at 3.0 V I/O
— 25 ns async page at 1.8 V or 3.0 V I/O
— 14 ns sync reads (tCHQV) at 1.8 V I/O
— 20 ns sync reads (tCHQV) at 3.0 V I/O
— Enhanced Factory Programming:
3.10 µs/Word (Typ)
■ Flash Architecture
— Read-While-Write/Erase
— Asymmetrical blocking structure
— 4-KWord parameter blocks (Top or
Bottom); 32-KWord main blocks
— 4-Mbit partition size
— 128-bit One-Time Programmable (OTP)
Protection Register
— Zero-latency block locking
— Absolute write protection with block
lock using F-VPP and F-WP#
■ Flash Software
— Intel® Flash Data Integrator (FDI) and
Common Flash Interface (CFI)
■ Quality and Reliability
— Extended Temperature: –25 °C to +85 °C
— Minimum 100K flash block erase cycle
— 90 nm ETOX™ IX flash technology
— 130 nm ETOX™ VIII flash technology
The Intel® Wireless Flash Memory (W18/W30 SCSP) family offers various flash plus static
RAM combinations in a common package footprint. The flash memory features 1.8 V low-
power operations with flexible, multi-partition, dual-operation Read-While-Write / Read-While-
Erase, asynchronous, and synchronous reads. This SCSP device integrates up to two flash die,
one PSRAM die, and one SRAM die in a low-profile package compatible with other SCSP
families with QUAD+ ballout.
www.DataSheet4U.com
www.DataSheet4U.com
Order Number: 251407, Revisiownw:w0.1D0ataSheet4U.com
18-Oct-2005
1 page  
32WQ and 64WQ Family—Intel® Wireless Flash Memory (W18/W30 SCSP)
Revision History
Date
June 2003
September
2003
May 2004
August 2004
January 2005
June 2005
October 2005
Revision
Description
-001
-002
-006
-007
-008
-009
-010
Initial release.
Changed PSRAM Read values.
Added new Transient Equivalent Testing Load Circuit figure.
General text edits.
Reformatted the datasheet and moved sections around according to the new layout.
Added 90 nm product information.
Added line items to Table 21 “32WQ and 64WQ W18/W30 SCSP Ordering Information (Flash
Only)” on page 50.
Added DC and AC specs for the new line items and edits to related sections.
Added line items to Table 21 “32WQ and 64WQ W18/W30 SCSP Ordering Information (Flash
Only)” on page 50
Added 32WQ product information.
Added line items to Table 21 “32WQ and 64WQ W18/W30 SCSP Ordering Information (Flash
Only)” on page 50
Removed Power-up sequence from Section 16; Added 70ns PSRAM (non-page mode)
specification Updated Ordering Information
Datasheet
Intel® Wireless Flash Memory (W18/W30 SCSP)
Order Number: 251407, Revision: 010
18-Oct-2005
5
5 Page 
Intel® Wireless Flash Memory (W18/W30 SCSP)
3.0 Package Information
The following packages are offered with the 32WQ and 64WQ Family:
• Figure 2, “Mechanical Specifications for 1- or 2-Die SCSP Device (8x10x1.2 mm)”
• Figure 3, “Mechanical Specifications for Triple-Die SCSP Device (8x10x1.4 mm)”
Figure 2.
Mechanical Specifications for 1- or 2-Die SCSP Device (8x10x1.2 mm)
Mark
123 456 78
A
B
C
D
E
F
G
H
J
K
L
M
8 7 6 5 4 3 21
A
B
C
D
E
DF
G
H
J
K
L
M
S2
e
b
E
Top View - Ball
D ow n
A2
A1
Bottom View - Ball Up
A
Y
Drawing not to scale.
Dimens ions
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Length
Package Body Width
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along E
Corner to Ball A1 Distance Along D
Symbol
A
A1
A2
b
D
E
e
N
Y
S1
S2
Min
0.200
0.325
9.900
7.900
1.100
0.500
Millimeters
Nom Max Notes
1.200
0.860
0.375
10.000
8.000
0.800
88
1.200
0.600
0.425
10.100
8.100
0.100
1.300
0.700
Min
0.0079
0.0128
0.3898
0.3110
0.0433
0.0197
Inches
Nom
0.0339
0.0148
0.3937
0.3150
0.0315
88
0.0472
0.0236
Ma
0.04
0.01
0.39
0.31
0.00
0.05
0.02
Datasheet
Intel® Wireless Flash Memory (W18/W30 SCSP)
Order Number: 251407, Revision: 010
18-Oct-2005
11
11 Page | ||
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