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UC1608 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 UC1608
기능 128COM x 240SEG Matrix LCD Controller-Driver
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UC1608 데이터시트, 핀배열, 회로
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HIGH-VOLTAGE MIXED-SIGNAL IC
128COM x 240SEG Matrix LCD Controller-Driver
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Product Specification
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ULTRACHIP
The Coolest LCD Driver. Ever!!
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UC1608 pdf, 반도체, 판매, 대치품
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UC1608
128x240 Matrix LCD Controller-Drivers
UC1608
Single-Chip, Ultra-Low Power
128COM x 240SEG Matrix
Passive LCD Controller-Driver
Support industry standard 8080 or 6800 bus
INTRODUCTION
protocol in either 8-bit or 4-bit parallel
interface.
UC1608 is an advanced high-voltage mixed-
signal CMOS IC, especially designed for the
Support two multiplexing rates (128, 96).
display needs of ultra-low power hand-held
devices.
Self-configuring 8x charge pump with on-
chip pumping capacitor requires only 5
This chip employs UltraChip’s unique DCC
external capacitors to operate.
(Direct Capacitor Coupling) driver architecture to
achieve near crosstalk free images.
Flexible data addressing/mapping schemes
to support wide ranges of software models
In addition to low power COM and SEG drivers,
and LCD layout placements.
UC1608 contains all necessary circuits for high-V
LCD power supply, bias voltage generation,
timing generation and graphics data memory.
Software programmable 4 temperature
compensation coefficients.
Advanced circuit design techniques are
employed to minimize external component
and reduce connector size while achieving
On-chip bypass capacitor for VLCD
cDouanttasSheet4U.comVLCLCDD
bypass
panels.
capacitor
optional
for
makes
small
extremely low power consumption.
On-chip Power-ON Reset and Software
RESET commands, make RST pin optional.
MAIN APPLICATIONS
Cellular Phones, Smart Phones, PDA and
other battery operated palm top devices
and/or portable Instruments
FEATURE HIGHLIGHTS
VDD (digital) range: 2.4V ~ 3.3V
VDD (analog) range: 2.4V ~ 3.3V
LCD VOP range:
6.5V ~ 15V
Available in gold bump dies
Bump pitch: 50uM min.
Bump gap: 18uM min.
Single chip controller-driver supports 128
COM x 240 SEG LCD, with vertical scroll.
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High-Voltage Mixed-Signal IC
©1999-2002
PIN DESCRIPTION
Name Type
Pins
VDD
VDD2
VDD3
PWR
VSS
VSS2
GND
VB3+ VB3–
VB2+ VB2–
VB1+ VB1–
VB0+ VB0–
PWR
SB3+ SB3–
SB2+ SB2–
SB1+ SB1–
SB0+ SB0–
I
VLCD-IN
VLCD-OUT
PWR
Description
MAIN POWER SUPPLY
VDD2/VDD3 is the analog VDD and it should be connected to the same
power source. VDD is the digital VDD and is connected to a voltage
source that is the same, or lower than VDD2/VDD3.
VDD supplies for digital logic and display data RAM.
VDD2 supplies for VLCD and VBIAS generator, VDD3 supplies for other
analog circuits.
Minimize the trace resistance for VDD and VDD2.
Ground. Connect VSS and VSS2 to the shared GND pin.
Minimize the trace resistance for VSS and VSS2.
LCD POWER SUPPLY
LCD Bias Voltages. These are the voltage source to provide SEG
driving currents. These voltages are generated internally. Connect
capacitors of CBX value between VBX+ and VBX–.
The resistance of these four traces directly affects the SEG driving
strength of the resulting LCD module. Minimize the trace resistance is
critical in achieving high quality image.
The sensor pins for CBX capacitors. Please connect these sensor pins
as closely to proper CBX pads as possible. These signals can tolerate
input resistance of up to 2K Ohm, so, narrow COF traces can be used.
HoweveDr,atthaeSnhoeiseet4oUn .tcheosme pins affects the accuracy of SEG driving
voltage level. To minimize noise caused by VBX-CBX charging current,
the trace resistance shared between VBX+/- and SBX+/- should be
minimized.
Main LCD Power Supply. Connect these pins together.
A by-pass capacitor CL is optional. When CL is used, connect CL
between VLCD and VSS, and keep the trace resistance under 300 Ohm.
NOTE
Recommended capacitor values:
CB: ~100x LCD load capacitance or 1.5uF (2V), whichever is higher.
CL: 10nF ~ 50nF (16V) is appropriate for most applications.
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