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64F2169ATE10 PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 64F2169ATE10
기능 HD64F2149
제조업체 Renesas Technology
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64F2169ATE10 데이터시트, 핀배열, 회로
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Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003




64F2169ATE10 pdf, 반도체, 판매, 대치품
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Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.

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64F2169ATE10 전자부품, 판매, 대치품
Main Revisions and Additions in this Edition
www.DataSheet4U.com
Page
Item
Revision (See Manual for Details)
All pages of
this manual
Amendments due to introduction of the H8S/2169
2 to 6
1. Overview
Table 1.1 Overview
CPU: operating frequency, and arithmetic operations
amended
PWM: maximum carrier frequency amended
PWMX: maximum carrier frequency amended
A/D converter: minimum conversion time amended
I/O ports: H8S/2169 added
Packages: TFP-144 (H8S/2169) added
Product lineup: amended
8 1.2 Internal Block Diagram Figure 1.1(b) Internal Block Diagram of H8S/2169 added
10
1.3.1 Pin Arrangement
Figure 1.2(b) H8S/2169 Pin Arrangement added
11 1.3.2 Pin Functions in Each Table 1.2(a) H8S/2149 Pin Functions in Each Operating
Operating Mode
Mode Pin No.9 : Pin function of Flash memory
programmer mode amended
16 to 21
1.3.2 Pin Functions in Each Table 1.2(b) H8S/2169 Pin Functions in Each Operating
Operating Mode
Mode
22 to 30
1.3.3 Pin Functions
Table 1.3 Pin Functions
Power (VCL), (VCCB) description amended
Clock (X1), (X2) description amended
Ports C to G description added
TFP-144 pin function added
All pages of
section 2
Notes on TAS instruction added
Notes on STM/LDM instruction added
32 2.1.1 Features
High-speed operation amended
73 2.9.4 On-Chip Supporting Added
Module Access Timing
(Internal I/O Register 3)
78
3.2.2 System Control
Address amended when bits 6 is 1
Register
79 3.2.3 Bus Control Register Address amended when bits 1 and 0 are 1, respectively
83 3.4 Pin Function in Each Table 3.3 Pin Functions in Each Mode
Operating Mode
Ports C to G added
84, 85
3.5 Memory Map in Each Figure 3.1 H8S/2169 or H8S/2149 Memory Map in Each
Operating Mode
Operating Mode amended

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64F2169ATE10

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