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PDF EXBE16xxxxJ Data sheet ( Hoja de datos )
| Número de pieza | EXBE16xxxxJ | |
| Descripción | (EXBD / EXBE / EXBA / EXBQ) Chip Resistor Networks | |
| Fabricantes | Panasonic | |
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Chip Resistor Networks
Type: EXBD:1206
EXBE:1608
EXBA:2512
EXBQ:1506
Chip Resistor Networks
n Features
l High density placing for digital signal circuits
á Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm ´ 2.1 mm ´ 0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm ´ 3.1 mm ´ 0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm ´ 1.6 mm ´ 0.45 mm, 0.5 mm pitch
á Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(ÒHigh density placingÓ is shown below)
l High speed mounting by conventional placing machine
<High density placing>
Pull up resistors
V CC
Direct placing on the bus line
EXBE10C
V CC
EXBA10P
V CC
IC IC DataSheet4U.com
IC IC IC
IC
No through hole
Through holes
0.4 mm pitch
0.635 mm pitch
n Explanation of Part Numbers
1 2 3 4 5 6 7 8 9 10 11 12
EXBE1 0C1 0 3 J
DataShee
Product Code
Thick Film
Resistor
Network
Dimension Code of
Chip Resistor Network
Type: inches Dimensions
D : 1206 3.2 mm ´1.6 mm
E : 1608 4.0 mm ´2.1 mm
A : 2512 6.4 mm ´3.1 mm
Q : 1506 3.8 mm ´1.6 mm
Number of
Terminals
10
16
Circuit Configuration
Code Common Terminal Position
C
Center common circuit
EXBD, EXBE
Diagonal common circuit
P (Terminal 5 and Terminal 10)
EXBA10P
One side common circuit
P (Terminal 16)
EXBQ16P
Diagonal common circuit
E (Terminal 1 and Terminal 6)
EXBA10E
Resistance Value
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Resistance Suffix for Special
Tolerance Requirements
J ±5 %
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Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us
Should a safety concern arise regarding this product, please be sure to contact us immediately.
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Chip Resistor Networks
n Recommended Soldering Conditions
Recommendations and precautions are described below.
l Recommended soldering conditions for reflow
áReflow soldering shall be two times maximum.
áPlease contact us for additional information when you
use in conditions other than those specified.
áPlease measure a temperature of terminations and study
solderability every kind of solder and board, before actual
use.
Peak
Preheating
Heating
Time
For solder (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 ¡C to 160 ¡C
Above 200 ¡C
235 ± 5 ¡C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free solder (Example : Sn/Ag/Cu)
Preheating
Main heating
Peak
Temperature
150 ¡C to 180 ¡C
Above 230 ¡C
max. 260 ¡C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
l Flow soldering
Ask the flow soldering of EXBA series to us. We can not recommended the flow soldering to Chip Resistor
Networks: EXBD/EXBE/EXBQ, because we are afraid that solder bridge happens owing to narrow 0.635 mm/
0.8 mm/0.5 mm pitch of EXBD/EXBE/EXBQ type.
Cautions for Safety
et4U.com
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
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1. Take measures against mechanical stress during and after mounting of Chip Resistors Networks(hereafter called the
Resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the Resistors on the land patterns. Otherwise, solder bridges may be caused.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the Resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the Resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 ¡C
max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply a shock to the Resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the Resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bend of printed circuit boards in order to protect the Resistors from abnormal stress.
DataShee
DataSheet4U.com
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us
Should a safety concern arise regarding this product, please be sure to contact us immediately.
DataSheet4 U .com
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| PDF Descargar | [ Datasheet EXBE16xxxxJ.PDF ] | |
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