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PDF NTTS2P03R2 Data sheet ( Hoja de datos )

Número de pieza NTTS2P03R2
Descripción Power MOSFET ( Transistor )
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NTTS2P03R2
Power MOSFET
−2.48 Amps, −30 Volts
P−Channel Enhancement Mode
Single Micro8t Package
Features
Ultra Low RDS(on)
Higher Efficiency Extending Battery Life
Miniature Micro8 Surface Mount Package
Diode Exhibits High Speed, Soft Recovery
Micro8 Mounting Information Provided
Applications
Power Management in Portable and Battery−Powered Products, i.e.:
Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance −
Junction−to−Ambient (Note 1.)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Thermal Resistance −
Junction−to−Ambient (Note 2.)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Thermal Resistance −
Junction−to−Ambient (Note 3.)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Pulsed Drain Current (Note 5.)
Thermal Resistance −
Junction−to−Ambient (Note 4.)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Pulsed Drain Current (Note 5.)
Operating and Storage
Temperature Range
VDSS
VGS
−30
"20
V
V
RθJA
PD
ID
ID
RθJA
PD
ID
ID
160 °C/W
0.78 W
−2.48
A
−1.98
A
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70
1.78
−3.75
−3.0
°C/W
W
A
A
RθJA
PD
ID
ID
IDM
210
0.60
−2.10
−1.67
−17
°C/W
W
A
A
A
RθJA
PD
ID
ID
IDM
TJ, Tstg
100
1.25
−3.02
−2.42
−24
−55 to
+150
°C/W
W
A
A
A
°C
1. Minimum FR−4 or G−10 PCB, Time 10 Seconds.
2. Mounted onto a 2square FR−4 Board (1sq. 2 oz Cu 0.06thick single
sided), Time 10 Seconds.
3. Minimum FR−4 or G−10 PCB, Steady State.
4. Mounted onto a 2square FR−4 Board (1sq. 2 oz Cu 0.06thick single
sided), Steady State.
5. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.
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−2.48 AMPERES
−30 VOLTS
85 mW @ VGS = −10 V
Single P−Channel
D
G
S
8
1
Micro8
CASE 846A
STYLE 1
MARKING DIAGRAM
& PIN ASSIGNMENT
Source
Source
Source
Gate
18
2 YWW 7
3 AE 6
45
Drain
Drain
Drain
Drain
(Top View)
Y = Year
WW = Work Week
AE = Device Code
ORDERING INFORMATION
Device
Package
Shipping
NTTS2P03R2
Micro8 4000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
December, 2003 − Rev. 1
1
Publication Order Number:
NTTS2P03R2/D
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NTTS2P03R2 pdf
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1000
NTTS2P03R2
TYPICAL ELECTRICAL CHARACTERISTICS
100 D = 0.5
0.2
0.1
10 0.05
0.02
0.01
1
SINGLE PULSE
0.1
1.0E−05 1.0E−04
1.0E−03
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
RθJC(t) = r(t) RθJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) − TC = P(pk) RθJC(t)
1.0E−02
1.0E−01
t, TIME (s)
1.0E+00
1.0E+01 1.0E+02 1.0E+03
Figure 13. Thermal Response
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